Relation between residual stress and microstructure evolution in C19400 alloy based on different annealing parameters
Source abstract
Abstract
The lead-frame C19400 strips are warped during the etching process due to the presence of the residual stress. Following annealing at 300 °C for 5 min, the residual stress decreased from 125.9 MPa (rolling direction, RD) and 137.1 MPa (transverse direction, TD) to 13.2 MPa (RD) and 16.5 MPa (TD). Following annealing at 500 °C, the alloy undergoes incomplete recrystallization. Moreover, there is a significant plastic mismatch between the “soft orientation” (Cube (001)<100>) and the “hard orientation” (S (123)<634> and Copper (112)<111>), resulting in an increase in residual stress. Furthermore, as the temperature increases, the(alpha)-Fe precipitates grow from 31 nm at 300 °C to 82 nm at 500 °C and maintain the semi-coherent relationship with the Cu matrix. The growth of(alpha)-Fe precipitates will lead to more plastic mismatch.Graphical abstract
Source: expertdata · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Aluminum Alloy Microstructure Properties · Welding Techniques and Residual Stresses · Microstructure and Mechanical Properties of Steels
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (61)
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