journal article·2009-10

The grain refinement mechanism of electrodeposited copper

Guoyong Wang, Zhonghao Jiang, Jianshe Lian, Qing Jiang

Journal of Materials Research· Volume 24· Issue 10
Publisher page

Abstract

Microstructure features of five electrodeposited coppers with different grain sizes were systematically characterized by using transmission electron microscopy (TEM) observations and x-ray diffraction (XRD) analysis. Based on the experimental observations, two mechanisms for the grain refinement in electrodeposited copper were identified: (i) twin–twin intersection can directly create grains with large-angle boundaries as small as 10 nm and (ii) grains can also be refined via formation of dislocation cells, transformation of dislocation cell walls into sub-boundaries with small misorientations, and evolution of sub-boundaries into highly misoriented grain boundaries. Besides, dislocations are also effective to cut twin lamellas into pieces and make twin boundaries curved and round.
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Research context

OpenAlex topics: Microstructure and mechanical properties · Metal and Thin Film Mechanics · Aluminum Alloys Composites Properties

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