journal article·2011-06-28

Formation of interfacial η′-Cu₆Sn₅in Sn–0.7Cu/Cu solder joints during isothermal aging

Zhongbing Luo, Lai Wang, Qinqin Fu, Chongqian Cheng, Jie Zhao

Journal of Materials Research· Volume 26· Issue 12

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Source: crossref · Quality: short

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OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Intermetallics and Advanced Alloy Properties

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References (11)

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