journal article·2014-03-14

Microstructural evolution and bonding mechanisms of the brazed Ti/ZrO₂joint using an Ag_68.8Cu_26.7Ti_4.5interlayer at 900 °C

Shen-Hung Wei, Chien-Cheng Lin

Journal of Materials Research· Volume 29· Issue 5

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Source: crossref · Quality: short

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OpenAlex topics: Aluminum Alloys Composites Properties · Advanced ceramic materials synthesis · Electronic Packaging and Soldering Technologies

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