Nanoindentation creep testing: Advantages and limitations of the constant contact pressure method
Source abstract
Abstract
Abstract Different loading protocols have been developed in the past to investigate the creep properties of materials using instrumented indentation testing technique. Recently, a new indentation creep method was presented, in which the contact pressure is kept constant during the creep test segment, similar to the constant stress applied in a uniaxial creep experiment. In this study, the results of constant contact pressure creep tests are compared to uniaxial and constant load hold indentation creep experiments on ultrafine grained Cu and CuAl5. The constant contact pressure method yields similar stress exponents as the uniaxial tests, down to indentation strain rates of 10–6 s−1, whereas the constant load hold method results mainly in a relaxation of the material at decreasing applied pressures. Furthermore, a pronounced change in the power law exponent at large stress reductions is found for both uniaxial and constant contact pressure tests, indicating a change in deformation mechanism of ultrafine grained metals. Graphical abstract
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Metal and Thin Film Mechanics · Microstructure and mechanical properties · Advanced materials and composites
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (62)
Show source-provided references
1. DIN, DIN EN ISO 204:2018 Metallic Material—Uniaxial Creep Testing in Tension—Method of Test (2018).
2. ASTM, E139-11 Standard Test Methods for Conducting Creep, Creep-Rupture, and Stress-Rupture Tests of Metallic Materials (2018)
3. DIN, Part 005: Uninterrupted creep and stress-rupture testing, in DIN EN 2002-005 Aerospace Series—Test Methods for Metallic Materials (2007)
4. S.J. Bull, Nanoindentation of coatings. J. Phys. D 38(24), R393–R413 (2005)10.1088/0022-3727/38/24/R01 ↗
5. K. Durst, M. Göken, Micromechanical characterisation of the influence of rhenium on the mechanical properties in nickel-base superalloys. Mater. Sci. Eng. A 387–389, 312–316 (2004)10.1016/j.msea.2004.03.079 ↗
6. W.D. Nix, Elastic and plastic properties of thin films on substrates: nanoindentation techniques. Mater. Sci. Eng. A 234–236, 37–44 (1997)10.1016/S0921-5093(97)00176-7 ↗
7. V. Maier et al., Nanoindentation strain-rate jump tests for determining the local strain-rate sensitivity in nanocrystalline Ni and ultrafine-grained Al. J. Mater. Res. 26(11), 1421–1430 (2011)10.1557/jmr.2011.156 ↗
8. V. Maier et al., An improved long-term nanoindentation creep testing approach for studying the local deformation processes in nanocrystalline metals at room and elevated temperatures. J. Mater. Res. 28(9), 1177–1188 (2013)10.1557/jmr.2013.39 ↗
9. P.S. Phani, W. Oliver, A direct comparison of high temperature nanoindentation creep and uniaxial creep measurements for commercial purity aluminum. Acta Mater. 111, 31–38 (2016)10.1016/j.actamat.2016.03.032 ↗
10. P.S. Phani, W. Oliver, G. Pharr, On the measurement of power law creep parameters from instrumented indentation. JOM 69(11), 2229–2236 (2017)10.1007/s11837-017-2535-z ↗
11. O. Prach et al., A new nanoindentation creep technique using constant contact pressure. J. Mater. Res. 34(14), 2492–2500 (2019)10.1557/jmr.2019.188 ↗
12. D. Matschkal-Amberger et al., New flat-punch indentation creep testing approach for characterizing the local creep properties at high temperatures. Mater. Des. 183, 108090 (2019)10.1016/j.matdes.2019.108090 ↗
13. P. Baral et al., A new long-term indentation relaxation method to measure creep properties at the micro-scale with application to fused silica and PMMA. Mech. Mater. 137, 103095 (2019)10.1016/j.mechmat.2019.103095 ↗
14. P. Baral et al., Indentation creep vs indentation relaxation: a matter of strain rate definition? Mater. Sci. Eng. A 781, 139246 (2020)10.1016/j.msea.2020.139246 ↗
15. D. Tabor, The Hardness of Metals (Clarendon Press, Oxford, 1951)
16. K.L. Johnson, The correlation of indentation experiments. J. Mech. Phys. Solids 18(2), 115–126 (1970)10.1016/0022-5096(70)90029-3 ↗
17. K.L. Johnson, K.L. Johnson, Contact Mechanics (Cambridge University Press, Cambridge, 1987)
18. D.L. Joslin, W.C. Oliver, A new method for analyzing data from continuous depth-sensing microindentation tests. J. Mater. Res. 5(1), 123–126 (1990)10.1557/JMR.1990.0123 ↗
19. W. Blum et al., Two mechanisms of dislocation motion during creep. Acta Metall. 37(9), 2439–2453 (1989)10.1016/0001-6160(89)90041-2 ↗
20. W. Blum, P. Eisenlohr, F. Breutinger, Understanding creep—a review. Metall. Mater. Trans. A 33(2), 291–303 (2002)10.1007/s11661-002-0090-9 ↗
21. W. Blum, P. Eisenlohr, J. Hu, Interpretation of unloading tests on nanocrystalline Cu in terms of two mechanisms of deformation. Mater. Sci. Eng. A 665, 171–174 (2016)10.1016/j.msea.2016.04.013 ↗
22. W. Blum, K. Durst, Kinetics of deformation and recovery of nanocrystalline Ni studied by stress reductions (2016)
23. W. Blum et al., Strain rate contribution due to dynamic recovery of ultrafine-grained Cu–Zr as evidenced by load reductions during quasi-stationary deformation at 0.5 Tm. Metals 9(11), 1150 (2019)10.3390/met9111150 ↗
24. R. Kapoor et al., Creep transients during stress changes in ultrafine-grained copper. Scr. Mater. 54(10), 1803–1807 (2006)10.1016/j.scriptamat.2006.01.032 ↗
25. K. Milička, Constant structure creep in metals after stress reduction in steady state stage. Acta Metall. Mater. 41(4), 1163–1172 (1993)10.1016/0956-7151(93)90164-N ↗
26. K. Milička, Constant structure experiments in high temperature primary creep of some metallic materials. Acta Metall. Mater. 42(12), 4189–4199 (1994)10.1016/0956-7151(94)90195-3 ↗
27. K. Milička, Constant structure creep experiments on aluminium. Kovove Mater 49, 307–318 (2011)10.4149/km_2011_5_307 ↗
28. D. Caillard, J.L. Martin, Thermally Activated Mechanisms in Crystal Plasticity. Pergamon Materials Series, vol. 8, ed. R.W. Cahn (2003).
29. W. Osthoff et al., Creep and relaxation behavior of lnconel-617. Nucl. Technol. 66(2), 296–307 (1984)10.13182/NT84-A33433 ↗
30. M.E. Kassner, Chapter 2—five-power-law creep, in Fundamentals of Creep in Metals and Alloys, 3rd edn., ed. by M.E. Kassner (Butterworth-Heinemann, Boston, 2015), pp. 7–10210.1016/B978-0-08-099427-7.00002-5 ↗
31. Z. Sun et al., Dynamic recovery in nanocrystalline Ni. Acta Mater. 91, 91–100 (2015)10.1016/j.actamat.2015.03.033 ↗
32. Z. Sun et al., Grain size and alloying effects on dynamic recovery in nanocrystalline metals. Acta Mater. 119, 104–114 (2016)10.1016/j.actamat.2016.08.019 ↗
33. Y. Liu et al., Room temperature nanoindentation creep of nanocrystalline Cu and Cu alloys. Mater. Lett. 70, 26–29 (2012)10.1016/j.matlet.2011.11.119 ↗
34. C.L. Wang et al., Creep of nanocrystalline nickel: a direct comparison between uniaxial and nanoindentation creep. Scr. Mater. 62(4), 175–178 (2010)10.1016/j.scriptamat.2009.10.021 ↗
35. R.S. Kottada, A.H. Chokshi, Low temperature compressive creep in electrodeposited nanocrystalline nickel. Scr. Mater. 53(8), 887–892 (2005)10.1016/j.scriptamat.2005.06.035 ↗
36. W.M. Yin et al., Creep behavior of nanocrystalline nickel at 290 and 373 K. Mater. Sci. Eng. A 301(1), 18–22 (2001)10.1016/S0921-5093(00)01385-X ↗
37. X.-S. Yang et al., Time-, stress-, and temperature-dependent deformation in nanostructured copper: creep tests and simulations. J. Mech. Phys. Solids 94, 191–206 (2016)10.1016/j.jmps.2016.04.021 ↗
38. X.-S. Yang et al., Time, stress, and temperature-dependent deformation in nanostructured copper: stress relaxation tests and simulations. Acta Mater. 108, 252–263 (2016)10.1016/j.actamat.2016.02.021 ↗
39. W. Blum, Creep of crystalline materials: experimental basis, mechanisms and models. Mater. Sci. Eng. A 319–321, 8–15 (2001)10.1016/S0921-5093(00)02010-4 ↗
40. M.A. Meyers, A. Mishra, D.J. Benson, Mechanical properties of nanocrystalline materials. Prog. Mater. Sci. 51(4), 427–556 (2006)10.1016/j.pmatsci.2005.08.003 ↗
41. M.A. Meyers, A. Mishra, D.J. Benson, The deformation physics of nanocrystalline metals: experiments, analysis, and computations. JOM 58(4), 41–48 (2006)10.1007/s11837-006-0214-6 ↗
42. Y.-J. Wang, A. Ishii, S. Ogata, Transition of creep mechanism in nanocrystalline metals. Phys. Rev. B 84(22), 224102 (2011)10.1103/PhysRevB.84.224102 ↗
43. G.T. Gray et al., Influence of strain rate & temperature on the mechanical response of ultrafine-grained Cu, Ni, and Al-4Cu-0.5Zr. Nanostruct. Mater. 9(1), 477–480 (1997)10.1016/S0965-9773(97)00104-9 ↗
44. Y. Wang, E. Ma, Temperature and strain rate effects on the strength and ductility of nanostructured copper. Appl. Phys. Lett. 83(15), 3165–3167 (2003)10.1063/1.1618370 ↗
45. Y. Li, X. Zeng, W. Blum, Transition from strengthening to softening by grain boundaries in ultrafine-grained Cu. Acta Mater. 52(17), 5009–5018 (2004)10.1016/j.actamat.2004.07.003 ↗
46. Q. Wei et al., Effect of nanocrystalline and ultrafine grain sizes on the strain rate sensitivity and activation volume: fcc versus bcc metals. Mater. Sci. Eng. A 381(1), 71–79 (2004)10.1016/j.msea.2004.03.064 ↗
47. S. Cheng et al., Tensile properties of in situ consolidated nanocrystalline Cu. Acta Mater. 53(5), 1521–1533 (2005)10.1016/j.actamat.2004.12.005 ↗
48. J. Chen, L. Lu, K. Lu, Hardness and strain rate sensitivity of nanocrystalline Cu. Scr. Mater. 54(11), 1913–1918 (2006)10.1016/j.scriptamat.2006.02.022 ↗
49. H. Chandler, A comparison between steady state creep and stress relaxation in copper. Mater. Sci. Eng. A 527(23), 6219–6223 (2010)10.1016/j.msea.2010.06.018 ↗
50. W. Blum et al., Deformation resistance in the transition from coarse-grained to ultrafine-grained Cu by severe plastic deformation up to 24 passes of ECAP. Mater. Sci. Eng. A 528(29), 8621–8627 (2011)10.1016/j.msea.2011.08.010 ↗
51. T. Suo et al., Compressive behavior and rate-controlling mechanisms of ultrafine grained copper over wide temperature and strain rate ranges. Mech. Mater. 61, 1–10 (2013)10.1016/j.mechmat.2013.02.003 ↗
52. J. Hu et al., Plastic deformation behavior during unloading in compressive cyclic test of nanocrystalline copper. Mater. Sci. Eng. A 651, 999–1009 (2016)10.1016/j.msea.2015.11.031 ↗
53. V. Maier-Kiener et al., Influence of solid solution strengthening on the local mechanical properties of single crystal and ultrafine-grained binary Cu–AlX solid solutions. J. Mater. Res. 32(24), 4583–4591 (2017)10.1557/jmr.2017.320 ↗
54. W.D. Nix, H. Gao, Indentation size effects in crystalline materials: a law for strain gradient plasticity. J. Mech. Phys. Solids 46(3), 411–425 (1998)10.1016/S0022-5096(97)00086-0 ↗
55. B. Merle et al., Experimental determination of the effective indenter shape and ε-factor for nanoindentation by continuously measuring the unloading stiffness. J. Mater. Res. 27(1), 214–221 (2012)10.1557/jmr.2011.245 ↗
56. K. Edalati et al., Influence of dislocation–solute atom interactions and stacking fault energy on grain size of single-phase alloys after severe plastic deformation using high-pressure torsion. Acta Mater. 69, 68–77 (2014)10.1016/j.actamat.2014.01.036 ↗
57. M. Monclús, J. Molina-Aldareguia, High Temperature Nanomechanical Testing. Handbook of Mechanics of Materials, ed. by C.H. Hsueh, S. Schmauder, C.-S. Chen, K.K. Chawla, N. Chawla, W. Chen, Y. Kagawa (2018).10.1007/978-981-10-6855-3_55-1 ↗
58. K. Zhang, J. Weertman, J. Eastman, Rapid stress-driven grain coarsening in nanocrystalline Cu at ambient and cryogenic temperatures. Appl. Phys. Lett. 87(6), 061921 (2005)10.1063/1.2008377 ↗
59. S. Brandstetter et al., Grain coarsening during compression of bulk nanocrystalline nickel and copper. Scr. Mater. 58(1), 61–64 (2008)10.1016/j.scriptamat.2007.08.042 ↗
60. W. Chen et al., Mechanically-induced grain coarsening in gradient nano-grained copper. Acta Mater. 125, 255–264 (2017)10.1016/j.actamat.2016.12.006 ↗
61. W.C. Oliver, G.M. Pharr, An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments. J. Mater. Res. 7(6), 1564–1583 (1992)10.1557/JMR.1992.1564 ↗
62. W.C. Oliver, G.M. Pharr, Measurement of hardness and elastic modulus by instrumented indentation: advances in understanding and refinements to methodology. J. Mater. Res. 19(1), 3–20 (2004)10.1557/jmr.2004.19.1.3 ↗