Elastic modulus of low-k dielectric thin films measured by load-dependent contact-resonance atomic force microscopy

Correlated force and contact resonance versus displacement responses have been resolved using load-dependent contact-resonance atomic force microscopy (AFM) to determine the elastic modulus of low-k dielectric thin films. The measurements consisted of recording simultaneously both the deflection and resonance frequency shift of an AFM cantilever probe as the probe was gradually brought in and out of contact. As the applied forces were restricted to the range of adhesive forces, low-k dielectric films of elastic modulus varying from GPa to hundreds of GPa were measurable in this investigation. Over this elastic modulus range, the reliability of load-dependent contact-resonance AFM measurements was confirmed by comparing these results with those from picosecond laser acoustic measurements.