Grain Morphology of Intermetallic Compounds at Solder Joints
Source abstract
Abstract
The grain morphology of the intermetallic compound (IMC) that forms at the interface between liquid solders and solid-metal substrates was observed at solder joints. Cu6Sn5 grains on Cu substrates were rough or rounded, and Ni3Sn4 grains on Ni substrates were faceted. Through the energy-based calculations, the relationship between the IMC grain morphology and Jackson's parameter α was explained. The Jackson's parameter of the IMC grain with a rough surface is smaller than 2 while it is larger than 2 for faceted grains.
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Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Metallurgical and Alloy Processes · Aluminum Alloy Microstructure Properties
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (20)
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