journal article·2011-09-28

Finite element analysis of blister formation in laser-induced forward transfer

Nicholas T. Kattamis, Matthew S. Brown, Craig B. Arnold

Journal of Materials Research· Volume 26· Issue 18
Publisher page

Abstract

Blister-actuated laser-induced forward transfer (BA-LIFT) is a direct-write technique, which enables high-resolution printing of sensitive inks for electronic or biological applications. During BA-LIFT, a polymer laser-absorbing layer deforms into an enclosed blister and ejects ink from an adjacent donor film. In this work, we develop a finite element model to replicate and predict blister expansion dynamics during BA-LIFT. Model inputs consist of standard mechanical properties, strain-rate-dependent material parameters, and a parameter encapsulating the thermal and optical properties of the film. We present methods to determine these material parameters from experimental measurements. The simulated expansion dynamics are shown to be in good agreement with experimental measurements using two different polymer layer thicknesses. Finally, the ability to model high-fluence blister rupture is demonstrated through a strain-based failure approach.
Source: expertdata · Quality: candidate unverified · Source record ↗

Research context

OpenAlex topics: Laser Material Processing Techniques · Surface Treatment and Residual Stress · Laser-Plasma Interactions and Diagnostics

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (56)

Show source-provided references
1. 10.1002/nme.162004010310.1002/nme.1620040103 ↗
2. 10.1063/1.300180310.1063/1.3001803 ↗
3. Bower · 2010 · 553
4. Warburton · 1976
5. 10.1007/s00339-010-5743-810.1007/s00339-010-5743-8 ↗
6. 10.1115/1.159567710.1115/1.1595677 ↗
7. 10.1090/qam/4829110.1090/qam/48291 ↗
8. 10.1016/0013-7944(85)90029-310.1016/0013-7944(85)90029-3 ↗
9. 10.1063/1.309837510.1063/1.3098375 ↗
10. 10.1016/j.bios.2004.08.04710.1016/j.bios.2004.08.047 ↗
11. Perzyna · 1966 · 9 · 243
12. 10.1016/j.ijimpeng.2004.03.00510.1016/j.ijimpeng.2004.03.005 ↗
13. 10.1098/rsta.1914.001010.1098/rsta.1914.0010 ↗
14. 10.1088/0957-4484/18/2/02540310.1088/0957-4484/18/2/025403 ↗
15. 10.1016/0013-7944(87)90155-X10.1016/0013-7944(87)90155-X ↗
16. Mittal · 2001 · 2 · 26
17. 10.1016/0045-7949(84)90033-610.1016/0045-7949(84)90033-6 ↗
18. Krüger · 1993 · 1332
19. 10.1163/156856191X0039610.1163/156856191X00396 ↗
20. 10.1016/j.orgel.2011.03.03210.1016/j.orgel.2011.03.032 ↗
21. Moaveni · 2007
22. 20. Dupont, Kapton Polyimide Film Product Information, p. 3.
23. 10.1243/JMES_JOUR_1960_002_016_0210.1243/JMES_JOUR_1960_002_016_02 ↗
24. 10.1063/1.219156910.1063/1.2191569 ↗
25. 10.1007/BF0034816810.1007/BF00348168 ↗
26. 10.1080/1478643730822098710.1080/14786437308220987 ↗
27. 10.1063/1.34678310.1063/1.346783 ↗
28. 10.1016/0013-7944(77)90013-310.1016/0013-7944(77)90013-3 ↗
29. Hertzberg · 1996 · 225
30. 10.1557/mrs2007.1110.1557/mrs2007.11 ↗
31. 10.1063/1.275947510.1063/1.2759475 ↗
32. 10.1007/s10404-011-0787-410.1007/s10404-011-0787-4 ↗
33. 10.1002/eqe.54110.1002/eqe.541 ↗
34. 10.1063/1.33728710.1063/1.337287 ↗
35. 40. Calister W.D. : Material Science and Engineering: An Introduction, 7th edition. (Wiley, New York, 2007).
36. 10.1063/1.36737710.1063/1.367377 ↗
37. A virtual crack-closure technique for calculating stress intensity factors for cracked three dimensional bodies10.1007/BF00035103 ↗
38. 10.1016/0045-7825(77)90023-810.1016/0045-7825(77)90023-8 ↗
39. 10.1002/nme.162009011410.1002/nme.1620090114 ↗
40. The incorporation of damping in lumped-parameter modelling techniques: Proceedings of the Institution of Mechanical Engineers, Part K
41. 10.1007/BF0035728810.1007/BF00357288 ↗
42. 10.1163/156856191X0059410.1163/156856191X00594 ↗
43. 10.1007/s00339-004-2586-110.1007/s00339-004-2586-1 ↗
44. 10.1007/BF0032425910.1007/BF00324259 ↗
45. 10.1063/1.279987710.1063/1.2799877 ↗
46. 10.1063/1.194489510.1063/1.1944895 ↗
47. 10.1016/0167-6636(88)90003-810.1016/0167-6636(88)90003-8 ↗
48. 10.1063/1.33601210.1063/1.336012 ↗
49. 10.1063/1.34947610.1063/1.349476 ↗
50. 10.1007/BF0035190210.1007/BF00351902 ↗
51. 10.1063/1.35090510.1063/1.350905 ↗
52. A novel laser transfer process for direct writing of electronic and sensor materials10.1007/s003390051400 ↗
53. 10.1063/1.12604010.1063/1.126040 ↗
54. 10.1063/1.332743210.1063/1.3327432 ↗
55. 10.1063/1.9796010.1063/1.97960 ↗
56. Gray · 2000 · 8 · 530