Microstructure, mechanical, and electrical properties of Cu–Ti₃AlC₂ and in situ Cu–TiC_x composites

Two kinds of composites (i.e., conductive and strong Cu–Ti₃AlC₂ composites) were prepared at 850 °C, while high-strength in situ Cu–TiC_x composites were prepared by consolidation at 850 °C and then hot pressing at 1000 °C. In both kinds of composites, the reinforcements were uniformly distributed within the Cu matrix. In Cu–Ti₃AlC₂ composites, strengthening was achieved by the load transfer through a strong interfacial layer consisting of TiC_x and Cu(Al), which was formed by the partial deintercalation of Al from Ti₃AlC₂. For the in situ Cu–TiC_x composites, the higher modulus of TiC_x as well as the highly twinned structure formed during processing contributed to the enhancement of strength. It was demonstrated that the deintercalation of Al from Ti₃AlC₂ formed substoichiometric Ti₃Al_xC₂ (with x < 1), and no detrimental effect on the electrical conductivity was observed.