journal article·1993-02

The yield stress of polycrystalline thin films

C.V. Thompson

Journal of Materials Research· Volume 8· Issue 2
Publisher page

Abstract

In recent experiments it has been shown that the yield stress of polycrystalline thin films depends separately on the film thickness and the grain size. It was also shown that the grain size dependence varies as the reciprocal of the grain size. In this paper an analysis is presented which leads to these results and provides a more detailed understanding of the origins of the observed behavior.
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Research context

OpenAlex topics: Copper Interconnects and Reliability · Semiconductor materials and devices · Metal and Thin Film Mechanics

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References (4)

Show source-provided references
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3. Nix · Metall. Trans. · 1989 · 20A
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