The cracking and decohesion of thin films
Source abstract
Abstract
The cracking and decohesion of thin films can be characterized by critical values of a nondimensional parameter governed by the residual stress, the film thickness, and a fracture resistance. This article reviews the status of understanding concerning the magnitude of this number for various types of adherent film on either brittle or ductile substrates. Important effects of elastic properties, substrate thickness, and yield strength are described.
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Research context
OpenAlex topics: Numerical methods in engineering · Geotechnical Engineering and Underground Structures · Non-Destructive Testing Techniques
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References (13)
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