Microstructure and Mechanical Properties of Copper Microtubes Fabricated via the Electroforming Process
Source abstract
Abstract
In this study, a Cu microtube electroforming process on a plastic mandrel that enables rapid mandrel removal without damage to the tubing is proposed. A square tube with a minimum internal dimension of about 500 μm and a circular tube with a minimum inner diameter of approximately 60 μm were successfully fabricated. The effects of additive type and power source on the microstructure and mechanical properties of the electroformed tubes were also studied. The electroformed Cu microtubes that exhibit and textures had columnar and fibrous grains that aligned well along their growth directions. The -oriented columnar grains were divided by high-density twin boundaries when organic gelatin was added. The use of a commercial cupracid additive suppressed grain growth, which resulted in microtubes with relatively weak textures and equiaxed grains. The tensile test results showed that the addition of gelatin and cupracid and the use of pulsed power increased the strength of the electroformed Cu microtubes. This finding was attributed to small grain size, specific crystallographic textures, and high volume fraction of the twin boundaries. These results showed that the electroformed Cu microtubes can have geometries smaller than the tubes formed with existing metal tubing processes while retaining high strength.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Nanomaterials and Printing Technologies · Metal Forming Simulation Techniques · Advanced Materials and Mechanics
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References (54)
Show source-provided references
1. S.Z. Guo, F. Gosselin, N. Guerin, A. Lanouette, M. Heuzey, and D. Therriault, Solvent-Cast Three-Dimensional Printing of Multifunctional Microsystems, Small, 2013, 9(24), p 4118–412210.1002/smll.201300975 ↗
2. A. Standaert, L. Brancato, B. Lips, F. Ceyssens, R. Puers, and P. Reynaert, Three Techniques for the Fabrication of High Precision, mm-Sized Metal Components Based on Two-Photon Lithography, Applied for Manufacturing Horn Antennas for THz Transceivers, J. Micromech. Microeng., 2018, 28, p 035008. https://doi.org/10.1088/1361-6439/aaa74b10.1088/1361-6439/aaa74b ↗
3. M. Mehrpouya and S. Emamian, Recent Advantages in Laser Fabrication of Micro-Channel Heat Exchangers, Materialwiss. Werkst., 2017, 48, p 205–20910.1002/mawe.201600759 ↗
4. S.K. Lee, D.C. Ko, B.M. Kim, J.H. Lee, S.W. Kim, and Y.S. Lee, A Study on Monobloc Tube Drawing for Steering Input Shaft, J. Mater. Process. Technol., 2007, 191(1–3), p 55–58
5. T. Furushima, A. Shirasaki, and K. Manabe, Fabrication of Noncircular Multicore Microtubes by Superplastic Dieless Drawing Process, J. Mater. Process. Technol., 2014, 214(1), p 29–3510.1016/j.jmatprotec.2013.07.005 ↗
6. W. Zheng, C.G. Wang, X.J. Lin, B.T. Tang, L.L. Huang, W.Z. Qing, and Y.Z. Sun, The Experimental Investigation of Size Effect on Micro-cylinder Deformation in Coining Process, Mater. Manuf. Process., 2014, 29(6), p 687–69010.1080/10426914.2014.912306 ↗
7. X.H. Dong, X.T. Hong, F. Chen, B.R. Sang, W. Yu, and X.P. Zhang, Effects of Specimen and Grain Sizes on Compression Strength of Annealed Wrought Copper Alloy at Room Temperature, Mater. Des., 2014, 64, p 400–40610.1016/j.matdes.2014.08.006 ↗
8. P. Hernández, D. Campos, P. Socorro, A. Benítez, F. Ortega, N. Díaz, and M.D. Marrero, Electroforming Applied to Manufacturing of Microcomponents, Procedia Eng., 2015, 132, p 655–66210.1016/j.proeng.2015.12.544 ↗
9. J. Liu, H. Hassanin, Z. Ni, Y. Yang, G. Yang, and K. Jiang, Production of High-Precision Micro Metallic Components by Electroforming Process, Mater. Manuf. Process., 2017, 32(12), p 1325–133010.1080/10426914.2016.1221092 ↗
10. V. Pretorius, E.R. Rohwer, P.J. Apps, K.H. Lawson, and J. Giesel, Manufacture, by Electroforming, of Thin-Walled Nickel Capillary Columns for Gas-Liquid Chromatography, J. Chromatogr. A, 1984, 289, p 17–2910.1016/S0021-9673(00)95073-8 ↗
11. M. Moravej, F. Prima, M. Fiset, and D. Mantovani, Electroformed Pure Iron as A New Biomaterial for Degradable Stents: In Vitro Degradation and Preliminary Cell Viability Studies, Acta Biomater., 2010, 6(5), p 1726–173510.1016/j.actbio.2010.01.010 ↗
12. G. Chatzipirpiridis, E. Avilla, O. Ergeneman, B.J. Nelson, and S. Pane, Electroforming of Magnetic Microtubes for Microrobotic Applications, IEEE. Trans. Magn., 2014, 50(11), p 1–310.1109/TMAG.2014.2325671 ↗
13. A. Takahiro, H. Masaaki, I. Yu, and A. Sakuichiro, Precise Dispensing Technology Using Electroformed Tubes for Micro-Volume Blood Diagnosis, IEEE. J. Transl. Eng. Health Med., 2018, 6, p 1–6
14. D.L. McCarthy and C.B. Williams, Creating Complex Hollow Metal Geometries Using Additive Manufacturing and Electroforming, in Proceeding of the the International Solid Freeform Fabrication Symposium (2012), pp. 108–120
15. A.L. Fan, S.K. Li, and W.H. Tian, Grain Growth and Texture Evolution in Electroformed Copper Liners of Shaped Charges, Mater. Sci. Eng. A, 2008, 474(1–2), p 208–21310.1016/j.msea.2007.04.001 ↗
16. A. Jung, M. Weinmann, and H. Natter, Electroforming and Electrodeposition on Complex 3D Geometries: Special Requirements and New Methods, Handbook of Nanoelectrochemistry: Electrochemical Synthesis Methods, Properties, and Characterization Techniques, M. Aliofkhazraei and A.S.H. Makhlouf, Ed., Springer, Cham, 2016, p 941–97010.1007/978-3-319-15266-0_46 ↗
17. Q.D. Cao, L. Fang, J.M. Lv, X.P. Zhang, and D.N. Thuy, Effects of Pulse Reverse Electroforming Parameters on the Thickness Uniformity of Electroformed Copper Foil, Trans. Inst. Met. Finish., 2018, 96, p 108–11210.1080/00202967.2018.1423736 ↗
18. S. Olivera, H.B. Muralidhara, K. Venkatesh, K. Gopalakrishna, and C.S. Vivek, Plating on Acrylonitrile–Butadiene–Styrene (ABS) Plastic: A Review, J. Mater. Sci., 2016, 51(8), p 3657–367410.1007/s10853-015-9668-7 ↗
19. Y.B. Zhao, X.D. Lv, and H.G. Ni, Solvent-Based Separation and Recycling of Waste Plastics: A Review, Chemosphere, 2018, 209, p 707–72010.1016/j.chemosphere.2018.06.095 ↗
20. H. Schott, Solubility Parameter, Specific Molar Cohesion, and the Solubility of Ethylene Oxide in Polymers, Biomaterials, 1982, 3(4), p 195–19810.1016/0142-9612(82)90018-7 ↗
21. C.L. Holloway and E.F. Kuester, Power Loss Associated with Conducting and Superconducting Rough Interfaces, IEEE. Trans. Microw. Theory, 2000, 48(10), p 1601–161010.1109/22.873886 ↗
22. Z. Li, Y. He, G. Tang, and W. Tao, Experimental and Numerical Studies of Liquid Flow and Heat Transfer in Microtubes, Int. J. Heat. Mass. Transf., 2007, 50(17–18), p 3447–346010.1016/j.ijheatmasstransfer.2007.01.016 ↗
23. M. Bazzaoui, E.A. Bazzaoui, J.I. Martins, and A. Albourine, Environmentally Friendly Process for Nickel Electroplating of ABS, Appl. Surf. Sci., 2012, 258(20), p 7968–797510.1016/j.apsusc.2012.04.146 ↗
24. D.G. Brandon, The Structure of High-Angle Grain Boundaries, Acta Mater., 1966, 14(11), p 1479–148410.1016/0001-6160(66)90168-4 ↗
25. N.A. Pangarov, Preferred Orientations in Electro-Deposited Metals, J. Electroanal. Chem., 1965, 9(1), p 70–85
26. T. Chan, Y. Chueh, and C. Liao, Manipulating the Crystallographic Texture of Nanotwinned Cu Films by Electrodeposition, Cryst. Growth Des., 2011, 11(11), p 4970–497410.1021/cg200877f ↗
27. C. Chen, C. Yang, Y. Wu, and C. Ho, Depth-Dependent Self-Annealing Behavior of Electroplated Cu, Surf. Coat. Technol., 2017, 320, p 489–49610.1016/j.surfcoat.2016.11.057 ↗
28. M. Gu, F.Z. Yang, and L. Huang, The Formation of Copper Electrodeposits with Highly Preferred Orientation and Their Surface Morphology, Acta Phys.-Chim. Sin., 2002, 18(11), p 973–978 ((in Chinese))10.3866/PKU.WHXB20021103 ↗
29. T.R. Chang, Y. Jin, L. Wen, C.S. Zhang, L. Christofer, W.O. Lnger, and J.P. Zhang, Synergistic Effects of Gelatin and Convection on Copper Foil Electrodeposition, Electrochim. Acta, 2016, 211, p 245–25410.1016/j.electacta.2016.06.051 ↗
30. A.A. Rasmussen, J.A.D. Jensen, A. Horsewell, and M.A.J. Somers, Microstructure in Electrodeposited Copper Layers; The Role of the Substrate, Electrochim. Acta, 2001, 47(1), p 67–7410.1016/S0013-4686(01)00583-7 ↗
31. H. Alimadadi, A.B. Fanta, T. Kasama, M.A.J. Somers, and K. Pantleon, Texture and Microstructure Evolution in Nickel Electrodeposited from an Additive-Free Watts Electrolyte, Surf. Coat. Technol., 2016, 299, p 1–610.1016/j.surfcoat.2016.04.068 ↗
32. F.L. Sun, L.Y. Gao, Z.Q. Liu, H. Zhang, T. Sugahara, S. Nagao, and K. Suganuma, Electrodeposition and Growth Mechanism of Preferentially Orientated Nanotwinned Cu on Silicon Wafer Substrate, J. Mater. Sci. Technol., 2018, 34(10), p 1885–189010.1016/j.jmst.2018.01.016 ↗
33. J. Zhang, K. Xu, and V. Ji, Dependence of Strain Energy on the Grain Orientations in an FCC-Polycrystalline Film on Rigid Substrate, Appl. Surf. Sci., 2002, 185, p 177–18210.1016/S0169-4332(01)00586-4 ↗
34. D.A. Brown, S. Morgan, V. Peldzinski, and R. Brüning, Crystal Growth Patterns in DC and Pulsed Plated Galvanic Copper Films on (111) (100) and (110) Copper Surfaces, J. Cryst. Growth, 2017, 478, p 220–22810.1016/j.jcrysgro.2017.09.009 ↗
35. E.M.D. Pena and S. Roy, Electrodeposited Copper Using Direct and Pulse Currents from Electrolytes Containing Low Concentration of Additives, Surf. Coat. Technol., 2018, 339, p 101–11010.1016/j.surfcoat.2018.01.067 ↗
36. S.H. Hu, Research on microstructure and mechanical properties and grain size effect of pure copper, Nanjing University of Science & Technology, Nanjing, 2016
37. Z.S. You, L. Lu, and K. Lu, Tensile Behavior of Columnar Grained Cu with Preferentially Oriented Nanoscale Twins, Acta Mater., 2011, 59(18), p 6927–693710.1016/j.actamat.2011.07.044 ↗
38. H. Jiang, Y.T. Zhu, D.P. Butt, I.V. Alexandrov, and T.C. Lowe, Microstructural Evolution, Microhardness and Thermal Stability of HPT-Processed Cu, Mater. Sci. Eng. A, 2000, 290, p 128–13810.1016/S0921-5093(00)00919-9 ↗
39. I.A. Ovid’Ko, R.Z. Valiev, and Y.T. Zhu, Review on Superior Strength and Enhanced Ductility of Metallic Nanomaterials, Prog. Mater Sci., 2018, 94, p 462–54010.1016/j.pmatsci.2018.02.002 ↗
40. R. Armstrong, L. Codd, R.M. Douthwaite, and N.J. Petch, The plastic deformation of polycrystalline aggregates, Philos. Mag., 1962, 7, p 45–5810.1080/14786436208201857 ↗
41. K. Yoshida, R. Brenner, B. Bacroix, and S. Bouvier, Effect of Regularization of Schmid Law on Self-consistent Estimates for Rate-independent Plasticity of Polycrystals, Eur. J. Mech. A-Solid, 2009, 28(5), p 905–91510.1016/j.euromechsol.2009.05.001 ↗
42. Y.F. Shen, L. Lu, Q.H. Lu, Z.H. Jin, and K. Lu, Tensile Properties of Copper with Nano-scale Twins, Scr. Mater., 2005, 52(10), p 989–99410.1016/j.scriptamat.2005.01.033 ↗
43. J. Li, B. Gao, Z. Huang, H. Zhou, Q. Mao, and Y.S. Li, Design for Strength-Ductility Synergy of 316L Stainless Steel with Heterogeneous Lamella Structure Through Medium Cold Rolling and Annealing, Vacuum, 2018, 157, p 128–13510.1016/j.vacuum.2018.08.049 ↗
44. J.W. Wyrzykowski and M.W. Grabski, The Hall–Petch Relation in Aluminium and its Dependence on the Grain Boundary Structure, Philos. Mag. A, 1986, 53(4), p 505–52010.1080/01418618608242849 ↗
45. C. Han, J.H. Lee, Y.S. Choi, S.H. Park, and S. Park, Effects of External Operating Environments on Fatigue of Heat-Exchanger Copper Tubes, Fatigue Fract. Eng. Mater Struct, 2018, 41, p 1546–155810.1111/ffe.12795 ↗
46. H.T. Kashi, M. Bahrami, K.J. Shahbazi, and G. Faraji, Microstructure and Mechanical Properties of the Ultrafine-Grained Copper Tube Produced by Severe Plastic Deformation, Iran. J. Mater. Sci. Eng., 2017, 14(2), p 32–40
47. L.H. Xiang, L.X. Shen, and L.P. Deng, Effects of Annealing Treatment on the Microstructure and Mechanical Properties of Copper Tube, Spec. Cast. Nonferr. Alloys, 2018, 38(7), p 796–801 ((in Chinese))
48. A. Babaei and M.M. Mashhadi, Tubular Pure Copper Grain Refining by Tube Cyclic Extrusion-Compression (TCEC) as A Severe Plastic Deformation Technique, Prog. Nat. Sci.-Mater., 2014, 24(6), p 623–63010.1016/j.pnsc.2014.10.009 ↗
49. S.H. Yang, F. Wang, and J.S. Liu, Influence of Multi-Pass Drawing Processing Rate on Mechanical Properties of TP2 Copper Material with Floating Plus, J. Shenyang Ligong Univ., 2013, 32(3), p 30–33 ((in Chinese))
50. X.H. Chen, L. Lu, and K. Lu, Grain Size Dependence of Tensile Properties in Ultrafine-Grained Cu with Nanoscale Twins, Scr. Mater., 2011, 64(4), p 311–31410.1016/j.scriptamat.2010.10.015 ↗
51. R.P. Sankar, B.Q. Khattak, A.K. Jain, R. Kaul, P. Ganesh, A.K. Nath, P. Tiwari, A. Amban, and A. Pagare, Electroforming of Copper by The Periodic Reversal Process, Surf. Eng., 2005, 21(3), p 204–20810.1179/174329405X50028 ↗
52. Z. Cheng, H.F. Zhou, Q.H. Lu, H.J. Gao, and L. Lu, Extra Strengthening and Work Hardening in Gradient Nanotwinned Metals, Science, 2018, https://doi.org/10.1126/science.aau192510.1126/science.aau1925 ↗
53. C.J. Shen, Z.W. Zhu, D. Zhu, and J.H. Ren, Copper Deposits with High Tensile Strength and Elongation Electroformed in an Ultra-Low-Concentration Sulfate Bath without Additives, J. Mater. Eng. Perform., 2017, 26(3), p 987–99210.1007/s11665-016-2494-5 ↗
54. C.J. Shen, Z.W. Zhu, and D. Zhu, Surface Self-nanocrystallization in Copper Electroforming, J. Mater. Eng. Perform., 2019, 28(1), p 211–22010.1007/s11665-018-3793-9 ↗