Correlation Analysis Between Porosity and Mechanical Properties of Porous Sintered Nanosilver Based on Indentation Response
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OpenAlex topics: Metal and Thin Film Mechanics · Tribology and Wear Analysis · Advanced ceramic materials synthesis
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References (35)
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1. G. Chen, G.Q. Lu, Y.H. Mei, X. Chen, and X. Li, Uniaxial Ratcheting Behavior of Sintered Nanosilver Joint for Electronic Packaging, Mater. Sci. Eng. A. Struct. Mater. Prop. Misrostruct. Process., 2014, 591, p 121–129.10.1016/j.msea.2013.10.091 ↗
2. S.A. Paknejad and S.H. Mannan, Review of Silver Nanoparticle-Based die Attach Materials for High Power/Temperature Applications, Microelectron. Reliability, 2017, 70, p 1–11.10.1016/j.microrel.2017.01.010 ↗
3. J. Ordonez-Miranda, M. Hermens, I. Nikitin, V.G. Kouznetsova, V.D.S. Olaf, M.A. Ras, J.S. Reparaz, M.R. Wagner, M. Sledzinska, and J. Gomis-Bresco, Measurement and Modeling of the Effective Thermal Conductivity of Sintered Silver Pastes, Int. J. Therm. Sci., 2016, 108, p 185.10.1016/j.ijthermalsci.2016.05.014 ↗
4. M. Knoerr, S. Kraft, and A. Schletz, Reliability Assessment of Sintered Nanosilver Die Attachment for Power Semiconductors, IEEE (2010)10.1109/EPTC.2010.5702605 ↗
5. X. Long, K. Chong, Y. Su, L. Du, and G. Zhang, Connecting the Macroscopic and Mesoscopic Properties of Sintered Silver Nanoparticles by Crystal Plasticity Finite Element Method, Eng. Fract. Mech., 2023, 281, 109137.10.1016/j.engfracmech.2023.109137 ↗
6. Y.S. Lee, C. Yun, K.H. Kim, W.H. Kim, S. Jeon, J.K. Lee, and J.P. Kim, Laser-Sintered Silver Nanoparticles as a Die Adhesive Layer for High-Power Light-Emitting Diodes, IEEE Trans. Compon. Packaging Manuf. Technol., 2017, 4(7), p 1119–1124.
7. L. Jiang, Thermo-Mechanical Reliability of Sintered-Silver Joint versus Lead-Free Solder for Attaching Large-Area Devices, Power Systems Conference, (2010)10.4271/2010-01-1728 ↗
8. G. Chen, Y. Cao, Y. Mei, D. Han, and X. Chen, Pressure-Assisted Low-Temperature Sintering of Nanosilver Paste for 55-Chip Attachment, IEEE Trans. Compon. Packaging, Manuf. Technol., 2012, 2(11), p 1759–1767.10.1109/TCPMT.2012.2214481 ↗
9. J. Fan, T. Gu, P. Wang, W. Cai, X. Fan, and G. Zhang, Constitutive Modeling of Sintered Nanosilver Particles: A Variable-order Fractional Model versus an Anand Model, In: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, (2021)10.1109/EuroSimE52062.2021.9410807 ↗
10. P. Panaccione, T. Wang, L. Guo-Quan, X. Chen, and S. Luo, Improved Heat Dissipation and Optical Performance of High-Power LED Packaging with Sintered Nanosilver Die-Attach Material, J. Microelectron. Electron. Packaging, 2010, 2010(DPC), p 001585–001605. https://doi.org/10.4071/2010DPC-wa4410.4071/2010DPC-wa44 ↗
11. J. Chen, X. Li, Y.F. Kong, Characterization of High-Power COB LED Module Attached by Low-Temperature Sintered Nanosilver, In: International Symposium on Structural Integrity, (2017)10.4028/www.scientific.net/AMM.853.389 ↗
12. H. Qin, Y. Cai, J. Dong, and Y.S. Lee, Direct Printing of Capacitive Touch Sensors on Flexible Substrates by Additive E-Jet Printing with Silver Nanoinks, J. Manuf. Sci. Eng., 2016, 139(3), p 031011.10.1115/1.4034663 ↗
13. R.A. Sailer, J.M. Hoey, I. Akhatov, O. Swenson, A. Lutfurakhmanov, M. Robinson, Ndsu Research Foundation, Micro Cold Spray Direct Write Systems and Methods for Printed Micro Electronics, US20140370203A1 (2014)
14. L. Zhang, H. Ji, H. Huang, N. Yi, X. Shi, S. Xie, Y. Li, Z. Ye, P. Feng, T. Lin, and X. Liu, Wearable Circuits Sintered at Room Temperature Directly on the Skin Surface for Health Monitoring, ACS Appl. Mater. Interfaces, 2020, 12(40), p 45504–45515.10.1021/acsami.0c11479 ↗
15. J.-W. Kim and S.-B. Jung, Electrical Characterization of Screen-Printed Conductive Circuit with Silver Nanopaste, Japan. J. Appl. Phys., 2009, 48(6S), p 06FD14. https://doi.org/10.1143/JJAP.48.06FD1410.1143/JJAP.48.06FD14 ↗
16. C. Ding, H. Liu, K.D.T. Ngo, R. Burgos, and G.Q. Lu, A Double-side Cooled SiC MOSFET Power Module with Sintered-silver Interposers: I. Design, Simulation, Fabrication, and Performance Characterization, IEEE Trans. Power Electron., 2021, 36(10), p 11672–11680.10.1109/TPEL.2021.3070326 ↗
17. J.G. Bai, Z.Z. Zhang, J.N. Calata, and G.Q. Lu, Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material, IEEE Trans. Compon. Packag. Technol., 2006, 29(3), p 589–593.10.1109/TCAPT.2005.853167 ↗
18. W.C. Oliver and G.M. Pharr, An Improved Technique for Determining Hardness and Elastic Modulus Using Load and Displacement Sensing Indentation Experiments, J. Mater. Res., 1992, 7(06), p 1564–1583.10.1557/JMR.1992.1564 ↗
19. X. Long, Z. Shen, C. Lu, Q. Jia, C. Guan, C. Chen, H. Wang, and Y. Li, Reverse Analysis of Surface Strain in Elasto-Plastic Materials by Nanoindentation, Int. J. Appl. Mech., 2021, 13(09), p 2150106.10.1142/S1758825121501064 ↗
20. S. Enders, N. Barbakadse, S. Gorb, and E. Arzt, Exploring Biological Surfaces by Nanoindentation, J. Mater. Res., 2004, 19(3), p 880–887.10.1557/jmr.2004.19.3.880 ↗
21. T.Y. Zhang and W.H. Xu, Surface Effects on Nanoindentation, J. Mater. Res., 2002, 17(7), p 1715–1720.10.1557/JMR.2002.0254 ↗
22. N.A. Fleck, H. Otoyo, and A. Needleman, Indentation of Porous Solids, Int. J. Solids Struct., 1992, 29(13), p 1613–1636.10.1016/0020-7683(92)90012-I ↗
23. X. Long, W. Tang, Y. Feng, C. Chang, L.M. Keer, and Y. Yao, Strain Rate Sensitivity of Sintered Silver Nanoparticles Using Rate-Jump Indentation, Int. J. Mech. Sci., 2018, 140, p 60–67. https://doi.org/10.1016/j.ijmecsci.2018.02.03510.1016/j.ijmecsci.2018.02.035 ↗
24. P. Clément, S. Meille, J. Chevalier, and C. Olagnon, Mechanical Characterization of Highly Porous Inorganic Solids Materials by Instrumented Micro-Indentation, Acta Mater., 2013, 61(18), p 6649–6660.10.1016/j.actamat.2013.07.005 ↗
25. D. Leslie, A. Dasgupta, Viscoplastic Properties of Pressure-Less Sintered Silver Materials Using Indentation, In: 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), (2016)10.1109/EuroSimE.2016.7463371 ↗
26. X. Long, B. Hu, Y. Feng, C. Chang, and M. Li, Correlation of Microstructure and Constitutive Behaviour of Sintered Silver Particles via Nanoindentation, Int. J. Mech. Sci., 2019, 161–162, p 105020.10.1016/j.ijmecsci.2019.105020 ↗
27. X. Long, Q. Jia, Z. Shen, M. Liu, and C. Guan, Strain Rate Shift for Constitutive Behaviour of Sintered Silver Nanoparticles Under Nanoindentation, Mech. Mater., 2021, 158, 103881.10.1016/j.mechmat.2021.103881 ↗
28. X. Chen, Y. Xiang, and J.J. Vlassak, Novel Technique for Measuring the Mechanical Properties of Porous Materials by Nanoindentation, J. Mater. Res., 2006, 21(3), p 715–724.10.1557/jmr.2006.0088 ↗
29. X. Long, C. Du, Z. Li, H. Guo, Y. Yao, X. Lu, X. Hu, L. Ye, and J. Liu, Finite Element Analysis to the Constitutive Behavior of Sintered Silver Nanoparticles Under Nanoindentation, Int. J. Appl. Mech., 2019, 10, p 1850110.10.1142/S1758825118501107 ↗
30. Y. Yao, Q. Huang, and S. Wang, Effects of Porosity and Pore Microstructure on the Mechanical Behavior of Nanoporous Silver, Mater. Today Commun., 2020, 24, p 101236.10.1016/j.mtcomm.2020.101236 ↗
31. A. Turon, P.P. Camanho, J. Costa, and C.G. Dávila, A Damage Model for the Simulation of Delamination in Advanced Composites Under Variable-Mode Loading, Mech. Mater., 2006, 38(11), p 1072–1089.10.1016/j.mechmat.2005.10.003 ↗
32. W. Wu, F. Qin, T. An, and P. Chen, Experimental and Numerical Investigation of Mechanical Properties of Electroplating Copper Filled in Through Silicon Vias, IEEE Trans. Compon. Packaging, Manuf. Technol., 2017, 6(1), p 1–8.
33. X. Long, Q.P. Jia, Z. Li, and S.X. Wen, Reverse Analysis of Constitutive Properties of Sintered Silver Particles from Nanoindentations, Int. J. Solids Struct., 2020, 191–192, p 351–362.10.1016/j.ijsolstr.2020.01.014 ↗
34. Y. Su, J.Q. Zhu, X. Long, L.G. Zhao, C. Chen, and C. Liu, Statistical Effects of Pore Features on Mechanical Properties and Fracture Behaviors of Heterogeneous Random Porous Materials by Phase-Field Modeling, Int. J. Solids Struct., 2023, 264, 112098.10.1016/j.ijsolstr.2022.112098 ↗
35. Z. Zhang, B. Wan, G. Fu, T. Su, Z. Wu, X. Wang, and X. Long, Impact Analysis of Microscopic Defect Types on the Macroscopic Crack Propagation in Sintered Silver Nanoparticles, Comput. Model. Eng. Sci., 2024, 139(1), p 441–458.