journal article·2024-05

Microstructure and Properties of High Strength and High Conductivity Cu-0.4Mg Alloy Processed by Upward Continuous Casting and Multi-pass Drawing

Yadong Ru, Zhaoshun Gao, Ling Zhang, Zhixiang Tang, Tingting Zuo, Jiangli Xue, Liye Xiao, Xuebin Li

Publisher page

Abstract

A Cu-0.4Mg (wt.%) alloy with high strength and high conductivity was fabricated by upward continuous casting and multi-pass drawing at room temperature. The microstructure, properties and strengthening mechanism of the Cu-0.4Mg alloy were studied. Results show that Cu-0.4Mg alloy reveals excellent comprehensive properties of ultimate tensile strength of 717 MPa and electrical conductivity of 70.4% IACS. The increment of strength was mainly contributed by grain refinement and dislocation strengthening. As the preparation method is simple and effective, it is a potential method for industrial production.
Source: expertdata · Quality: candidate unverified · Source record ↗

Research context

OpenAlex topics: Microstructure and mechanical properties · Aluminum Alloys Composites Properties · Aluminum Alloy Microstructure Properties

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (44)

Show source-provided references
1. Y. Zhao, P. Liu, X. Liu, X. Chen, F. Ma, W. Li, and D. He, Research Progress and Application of Contact Wire for High-Speed Electric Railway, Mater. Rev, 2012, 26(3), p 46.
2. Z. Qiang, Introduction and Innovation of the Technology for Producing Cumg Contact Wire for High-Speed Railway, Railw. Locomot. Car, 2009, 29(3), p 77–79.
3. Y. Tang, Y. Kang, L. Yue, and X. Jiao, Mechanical Properties Optimization of a Cu-Be-Co-Ni Alloy by Precipitation Design, J. Alloy. Compd., 2017, 695, p 613–625.10.1016/j.jallcom.2016.11.014 ↗
4. Q. Dong, L. Shen, F. Cao, Y. Jia, K. Liao, and M. Wang, Effect of Thermomechanical Processing on the Microstructure and Properties of a Cu-Fe-P Alloy, J. Mater. Eng. Perform., 2015, 24(4), p 1531–1539.10.1007/s11665-014-1352-6 ↗
5. Q. Lei, Z. Li, Y. Gao, X. Peng, and B. Derby, Microstructure and Mechanical Properties of a High Strength Cu-Ni-Si Alloy Treated by Combined Aging Processes, J. Alloy. Compd., 2017, 695, p 2413–2423.10.1016/j.jallcom.2016.11.137 ↗
6. S. Mu, F. Guo, Y. Tang, X. Cao, and M. Tang, Study on Microstructure and Properties of Aged Cu-Cr-Zr-Mg-RE Alloy, Mater. Sci. Eng. A, 2008, 475(1–2), p 235–240.10.1016/j.msea.2007.04.056 ↗
7. K. Maki, Y. Ito, H. Matsunaga, and H. Mori, Solid-Solution Copper Alloys with High Strength and High Electrical Conductivity, Scr. Mater., 2013, 68(10), p 777–780.10.1016/j.scriptamat.2012.12.027 ↗
8. Y. Sakai, T. Hibaru, and K. Miura, Development of High Strength-High Conductivity Cu-6 wt.% Ag Alloy for High Field Magnet, Mrs Adv., 2015, 1(17), p 1137–1148.10.1557/adv.2015.4 ↗
9. S. Gorsse, B. Ouvrard, M. Gouné, and A. Poulon-Quintin, Microstructural Design of New High Conductivity-High Strength Cu-Based Alloy, J. Alloy. Compd., 2015, 633, p 42–47.10.1016/j.jallcom.2015.01.234 ↗
10. Z. Guo, Y. Kim, H. Li, J. Koo, C. Seok, K. Lee, and S. Kwon, Bending Fatigue Life Evaluation of Cu-Mg Alloy Contact Wire, Int. J. Precis. Eng. Manuf., 2014, 15(7), p 1331–1335.10.1007/s12541-014-0473-z ↗
11. G. Yang, Z. Li, Y. Yuan, and Q. Lei, Microstructure, Mechanical Properties and Electrical Conductivity of Cu-0.3Mg-0.05Ce Alloy Processed by Equal Channel Angular Pressing and Subsequent Annealing, J. Alloy. Compd., 2015, 640, p 347–354.10.1016/j.jallcom.2015.03.218 ↗
12. B. Wang, Y. Zhang, B. Tian, Y. Jia, A. Volinsky, V. Yakubov, and M. Fu, Nanoscale Precipitates Evolution and Strengthening Mechanism of the Aged Cu-Mg-Fe-Sn-P-Y Electrical Contact Wire, J. Mater. Res. Technol., 2020, 9(3), p 6352–6359.10.1016/j.jmrt.2020.03.051 ↗
13. Y. Li, Z. Xiao, Z. Li, Z. Zhou, Z. Yang, and Q. Lei, Microstructure and Properties of a Novel Cu-Mg-Ca Alloy with High Strength and High Electrical Conductivity, J. Alloy. Compd., 2017, 723, p 1162–1170.10.1016/j.jallcom.2017.06.155 ↗
14. M. Ma, Z. Li, W. Qiu, Z. Xiao, Z. Zhao, and Y. Jiang, Microstructure and Properties of Cu-Mg-Ca Alloy Processed by Equal Channel Angular Pressing, J. Alloy. Compd., 2019, 788, p 50–60.10.1016/j.jallcom.2019.01.335 ↗
15. C. Zhu, A. Ma, J. Jiang, X. Li, D. Song, D. Yang, Y. Yuan, and J. Chen, Effect of ECAP Combined Cold Working on Mechanical Properties and Electrical Conductivity of Conform-Produced Cu-Mg Alloys, J. Alloy. Compd., 2014, 582, p 135–140.10.1016/j.jallcom.2013.08.007 ↗
16. Y. Tong, S. Li, D. Zhang, L. Li, and Y. Zheng, High Strength and High Electrical Conductivity Cumg Alloy Prepared by Cryorolling, Trans. Nonferrous Met. Soc. China, 2019, 29(3), p 595–600.10.1016/S1003-6326(19)64968-X ↗
17. Y. Yuan, C. Dai, Z. Li, G. Yang, Y. Liu, and Z. Xiao, Microstructure Evolution of Cu-0.2Mg Alloy during Continuous Extrusion Process, J. Mater. Res., 2015, 30(18), p 2783–2791.10.1557/jmr.2015.237 ↗
18. Y. Ito, H. Matsunaga, H. Mori, and K. Maki, Effect of Plastic Deformation on the Proof Strength and Electrical Conductivity of Copper-Magnesium Supersaturated Solid-Solution Alloys, Mater. Trans., 2014, 55(11), p 1738–1741.10.2320/matertrans.M2014220 ↗
19. J. An, B. Wang, Y. Zhang, B. Tian, A. Volinsky, Y. Liu, and G. Wang, Mechanical and Electrical Properties and Phase Analysis of Aged Cu-Mg-Ce Alloy, J. Mater. Eng. Perform., 2020, 29(1), p 1–9.10.1007/s11665-019-04524-y ↗
20. Y. Duan, G. Xu, L. Tang, Z. Li, and G. Yang, Microstructure and Properties of the Novel Cu–0.30Mg–0.05Ce Alloy Processed by Equal Channel Angular Pressing, Mater. Sci. Eng. A, 2015, 648, p 252–259.10.1016/j.msea.2015.09.078 ↗
21. M. Ma, Z. Li, W. Qiu, Z. Xiao, Z. Zhao, Y. Jiang, Z. Xia, and H. Huang, Development of Homogeneity in a Cu-Mg-Ca Alloy Processed by Equal Channel Angular Pressing, J. Alloy. Compd., 2020, 820, p 153112.10.1016/j.jallcom.2019.153112 ↗
22. P. Rodríguez-Calvillo, N. Ferrer, and J. Cabrera, Analysis of Microstructure and Strengthening in CuMg Alloys Deformed by Equal Channel Angular Pressing, J. Alloy. Compd., 2015, 626, p 340–348.10.1016/j.jallcom.2014.12.043 ↗
23. A. Ma, C. Zhu, J. Chen, J. Jiang, D. Song, S. Ni, and Q. He, Grain Refinement and High-Performance of Equal-Channel Angular Pressed Cu-Mg Alloy for Electrical Contact Wire, Metals, 2014, 4(4), p 586–596.10.3390/met4040586 ↗
24. H. Chen, D. Yuan, W. Xie, J. Zhang, H. Wang, and B. Yang, A Novel Route for Strengthening Copper Rods: Non-solution Heat Treatment Combined with Pre-aging, J. Mater. Process. Technol., 2019, 274, p 116290.10.1016/j.jmatprotec.2019.116290 ↗
25. Z. Sun, H. Zeng, J. Chen, S. Wu, J. Liu, Z. An, and B. Yang, Effect of Solid Solution Process on the Structure and Properties of Cu-Cr-Mg Alloy in the Aging State, J. Alloy. Compd., 2022, 914, p 165274.10.1016/j.jallcom.2022.165274 ↗
26. N. Muramatsu and M. Akaiwa, Characteristics of Hypoeutectic Cu-Zr Alloy Rods Manufactured by Vertically Upwards Continuous Casting, Mater. Trans., 2016, 57, p 1794.10.2320/matertrans.M2016181 ↗
27. R. Gavrilova, V. Hadzhiyski, and M. Mihovsky, Structure and Mechanical Properties of Vertical Upwards Continuously Casted Aluminium Wires, Struct. Integr. Life-Integritet I Vek Konstrukcija, 2010, 10(3), p 219–223.
28. X. Zhu, Z. Xiao, J. An, H. Jiang, Y. Jiang, and Z. Li, Microstructure and Properties of Cu-Ag Alloy Prepared by Continuously Directional Solidification, J. Alloy. Compd., 2021, 883, p 160769.10.1016/j.jallcom.2021.160769 ↗
29. Y. Sakai and H. Schneider-Muntau, Ultra-high Strength, High Conductivity Cu-Ag Alloy Wires, Acta Mater., 1997, 45(3), p 1017–1023.10.1016/S1359-6454(96)00248-0 ↗
30. M. Xie, W. Huang, H. Chen, L. Gong, and B. Yang, Microstructural Evolution and Strengthening Mechanisms in Cold-Rolled Cu-Ag Alloys, J. Alloy. Compd., 2021, 851, p 156893.10.1016/j.jallcom.2020.156893 ↗
31. H. Cheng, H. Wang, Y. Xie, Q. Tang, and P. Dai, Controllable Fabrication of a Carbide-Containing FeCoCrNiMn High-Entropy Alloy: Microstructure and Mechanical Properties, Mater. Sci. Technol., 2017, 33(17), p 1–8.10.1080/02670836.2017.1342367 ↗
32. H. Wen, T. Topping, D. Isheim, D. Seidman, and E. Lavernia, Strengthening Mechanisms in a High-Strength Bulk Nanostructured Cu-Zn-Al Alloy Processed Via Cryomilling and Spark Plasma Sintering, Acta Mater., 2013, 61(8), p 2769–2782.10.1016/j.actamat.2012.09.036 ↗
33. S. Dasharath, K. Carl, and S. Mula, Effect of Stacking Fault Energy on Mechanical Properties and Strengthening Mechanisms of Brasses Processed by Cryorolling, Mater. Charact., 2015, 110, p 14–24.10.1016/j.matchar.2015.10.006 ↗
34. P. Luo, D. Mcdonald, S. Zhu, S. Palanisamy, M.D. Argusch, and K. Xia, Analysis of Microstructure and Strengthening in Pure Titanium Recycled from Machining Chips By Equal Channel Angular Pressing Using Electron Backscatter Diffraction, Mater. Sci. Eng. A, 2012, 538, p 252–258.10.1016/j.msea.2012.01.039 ↗
35. P. Luo, D. Mcdonald, W. Xu, S. Palanisamy, M.D. Argusch, and K. Xia, A Modified Hall-Petch Relationship in Ultrafine-grained Titanium Recycled from Chips by Equal Channel Angular Pressing, Scr. Mater., 2012, 66, p 785.10.1016/j.scriptamat.2012.02.008 ↗
36. S. Zhou, W. Yi, F. Shi, F. Sommer, L. Chen, Z. Liu, and R. Napolitano, Modeling of Thermodynamic Properties and Phase Equilibria for the Cu-Mg Binary System, J. Phase Equilib. Diffus., 2007, 28(2), p 158–166.10.1007/s11669-007-9022-0 ↗
37. N. Hansen, Hall-Petch Relation and Boundary Strengthening, Scr. Mater., 2004, 51, p 801.10.1016/j.scriptamat.2004.06.002 ↗
38. N. Hansen, Boundary Strengthening in Undeformed and Deformed Polycrystals, Mater. Sci. Eng. A, 2005, 409(1–2), p 39–45.10.1016/j.msea.2005.04.061 ↗
39. J. Bailey and P. Hirsch, The Dislocation Distribution, Flow Stress, and Stored Energy in Cold-Worked Polycrystalline Silver, Philos. Mag., 1960, 5(53), p 485–497.10.1080/14786436008238300 ↗
40. J. Gubicza, N. Chinh, J. Lábár, S. Dobatkin, H. SZ, and T. Langdon, Correlation between Microstructure And Mechanical Properties of Severely Deformed Metals, J. Alloy. Compd., 2009, 483(1–2), p 271–274.10.1016/j.jallcom.2008.07.200 ↗
41. M. Staker and D. Holt, The Dislocation Cell Size and Dislocation Density in Copper Deformed at Temperatures between 25 and 700 °C, Acta Metall. Mater., 1972, 20(4), p 569–579.10.1016/0001-6160(72)90012-0 ↗
42. W. Callister and D. Rethwisch, Materials Science and Engineering: An Introduction, Wiley, New York, NY, 2007.
43. E. Kozlov, A. Zhdanov, N. Popova, E. Pekarskaya, and N. Koneva, Subgrain Structure and Internal Stress Fields in UFG Materials: Problem of Hall-Petch Relation, Mater. Sci. Eng. A, 2004, 387, p 789–794.10.1016/j.msea.2003.12.081 ↗
44. S. Zhou, Y. Wang, F. Shi, F. Sommer, L. Chen, Z. Liu, and R. Napolitano, Modeling of Thermodynamic Properties and Phase Equilibria for the Cu-Mg Binary System, J. Phase Equilib. Diffus., 2007, 28(2), p 158–166.10.1007/s11669-007-9022-0 ↗