Effect of Ni Content on the Microstructure Formation and Properties of Sn-0.7Cu-xNi Solder Alloys
Source abstract
Abstract
Sn-Cu based solders have been widely investigated due to their good mechanical properties, good fluidity, narrow melting range, environmental friendliness, and low price. In this paper, the effect of Ni content on the microstructure, mechanical properties, melting behavior, spreadability, and conductivity of Sn-0.7 Cu-xNi (0.5-2.0 mass%, mass fraction except when specified) lead-free solders was studied. The Sn-0.7Cu-xNi (x = 0.5, 1.0, 1.5, and 2.0) solder alloys consisted of a β-Sn solid solution, Ni3Sn4 phase, and Cu6Sn5 phase. The volume fraction of Ni3Sn4 increased with increasing Ni content. The addition of Ni increased the solidus and liquidus temperatures of the Sn-0.7Cu-xNi solder alloys. However, the melting range of the Sn-0.7Cu-0.5Ni and Sn-0.7Cu-1.0Ni solder alloys is lower than that of the Sn-0.5Cu solder alloy. The spreading area of the Sn-0.7Cu-xNi solder alloy first increased and then decreased with increasing Ni content. Moreover, the ultimate tensile strength and hardness of the Sn-0.7Cu-xNi solder alloy increased gradually with increasing Ni content. The Sn-0.7Cu-2.0Ni alloy has maximum ultimate tensile strength and hardness values of 52.01 MPa and 16.45 Hv, respectively. However, the electrical conductivity of the Sn-0.7Cu-xNi solder alloy decreased with increasing Ni content. These changes in performance related to the formation of the intermetallic Ni3Sn4 phase. The Sn-0.7Cu-1.0Ni solder alloy had the best comprehensive performance in the present experiment. For the Sn-0.7Cu-1.0Ni solder alloy, the expanded area was 1.28 times that of the Sn-0.7Cu alloy, and the liquidus temperature, melting range, strength, hardness, and resistivity of the alloy solder were at the intermediate level among the Sn-0.7Cu-xNi solder alloys. Therefore, the Sn-0.7Cu-1.0Ni alloy is a relatively ideal solder alloy with a good comprehensive performance among the Sn-0.7Cu-xNi solder alloys.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Advanced Welding Techniques Analysis
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References (49)
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1. M. Zhao, L. Zhang, Z. Liu, M. Xiong, and L. Sun, Structure and Properties of Sn-Cu Lead-Free Solders in Electronics Packaging, Sci. Technol. Adv. Mater., 2019, 20, p 421–44410.1080/14686996.2019.1591168 ↗
2. J. Cheng, X. Hu, and X. Jiang, Interfacial Reaction and IMC Growth Between Sn-37Pb and Heterogeneous Dual-Phase Substrate, Vacuum, 2019, 159, p 112–12410.1016/j.vacuum.2018.10.024 ↗
3. G. Khatibi, A. Betzwar Kotas, and M. Lederer, Effect of Aging on Mechanical Properties of High Temperature Pb-Rich Solder Joints, Microelectron. Reliab., 2018, 85, p 1–1110.1016/j.microrel.2018.03.009 ↗
4. H. Ma and J.C. Suhling, A Review of Mechanical Properties of Lead-Free Solders for Electronic Packaging, J. Mater. Sci., 2009, 44, p 1141–115810.1007/s10853-008-3125-9 ↗
5. Y. Li and C.P. Wong, Recent Advances of Conductive Adhesives as a Lead-Free Alternative in Electronic Packaging: Materials, Processing, Reliability and Applications, Mater. Sci. Eng. R: Rep., 2006, 51, p 1–3510.1016/j.mser.2006.01.001 ↗
6. M.J. Rizvi, C. Bailey, Y.C. Chan, M.N. Islam, and H. Lu, Effect of Adding 0.3wt% Ni into the Sn-0.7 wt% Cu Solder: Part II, Growth of Intermetallic Layer with Cu During Wetting and Aging, J. Alloys Compd., 2007, 438, p 122–12810.1016/j.jallcom.2006.08.071 ↗
7. J. Wang, S. Xue, C. Ma, W. Long, and S. Zhong, Research Progress on Reliability of Lead-Free Solders Under Special Conditions, Chin. J. Nonferrous Metals, 2018, 28, p 2499–251110.1016/S1003-6326(18)64896-4 ↗
8. H.R. Kotadia, P.D. Howes, and S.H. Mannan, A Review: on the Development of Low Melting Temperature Pb-Free Solders, Microelectron. Reliab., 2014, 54, p 1253–127310.1016/j.microrel.2014.02.025 ↗
9. K. Zeng and K.N. Tu, Six Cases of Reliability Study of Pb-Free Solder Joints in Electronic Packaging Technology, Mater. Sci. Eng. R: Reports, 2002, 38, p 55–10510.1016/S0927-796X(02)00007-4 ↗
10. M.A. Fazal, N.K. Liyana, S. Rubaiee, and A. Anas, A Critical Review on Performance, Microstructure and Corrosion Resistance of Pb-Free Solders, Measurement, 2019, 134, p 897–90710.1016/j.measurement.2018.12.051 ↗
11. A.F. Abd El-Rehim and H.Y. Zahran, Investigation of Microstructure and Mechanical Properties of Sn-xCu Solder Alloys, J. Alloys Compd., 2017, 695, p 3666–367310.1016/j.jallcom.2016.11.371 ↗
12. G. Zeng, S. Xue, L. Zhang, and L. Gao, Recent Advances on Sn-Cu Solders with Alloying Elements: Review, J. Mater. Sci.: Mater. Electron., 2011, 22, p 565–578
13. H. Wang, J. Fang, Z. Xu, and X. Zhang, Improvement of Ga and Zn Alloyed Sn-0.7Cu Solder Alloys and Joints, J. Mater. Sci.: Mater. Electron., 2015, 26, p 3589–3595
14. W. Liao, C. Chen, M. Lin, and C. Wang, Enhanced Growth of the Ni3Sn4 Phase at the Sn/Ni Interface Subjected to Strains, Scr. Mater., 2011, 65, p 691–69410.1016/j.scriptamat.2011.07.007 ↗
15. L.F. Li, Y.K. Cheng, G.L. Xu, E.Z. Wang, Z.H. Zhang, and H. Wang, Effects of Indium Addition on Properties and Wettability of Sn-0.7Cu-0.2Ni Lead-Free Solders, Mater. Des., 2014, 64, p 15–2010.1016/j.matdes.2014.07.035 ↗
16. A.A. El-Daly and A.E. Hammad, Enhancement of Creep Resistance and Thermal Behavior of Eutectic Sn-Cu Lead-Free Solder Alloy by Ag and In-Additions, Mater. Des., 2012, 40, p 292–29810.1016/j.matdes.2012.04.007 ↗
17. G. Zeng, S.D. McDonald, Q. Gu, Y. Terada, K. Uesugi, H. Yasuda, and K. Nogita, The Influence of Ni and Zn Additions on Microstructure and Phase Transformations in Sn-0.7Cu/Cu Solder Joints, Acta Mater., 2015, 83, p 357–37110.1016/j.actamat.2014.10.003 ↗
18. A.A. El-Daly, F. El-Tantawy, A.E. Hammad, M.S. Gaafar, E.H. El-Mossalamy, and A.A. Al-Ghamdi, Structural and Elastic Properties of Eutectic Sn-Cu Lead-Free Solder Alloy Containing Small Amount of Ag and In, J. Alloys Compd., 2011, 509, p 7238–724610.1016/j.jallcom.2011.01.062 ↗
19. T. Laurila, V. Vuorinen, and M. Paulasto-Kröckel, Impurity and Alloying Effects on Interfacial Reaction Layers in Pb-Free Soldering, Mater. Sci. Eng. R: Reports, 2010, 68, p 1–3810.1016/j.mser.2009.12.001 ↗
20. T. El-Ashram and R.M. Shalaby, Effect of Rapid Solidification and Small Additions of Zn and Bi on the Structure and Properties of Sn-Cu Eutectic Alloy, J. Electron. Mater., 2005, 34, p 212–21510.1007/s11664-005-0234-y ↗
21. Y. Kim, K. Kim, C. Hwang, and K. Suganuma, Effect of Composition and Cooling Rate on Microstructure and Tensile Properties of Sn-Zn-Bi Alloys, J. Alloys Compd., 2003, 352, p 237–24510.1016/S0925-8388(02)01168-4 ↗
22. S. Huh, K. Kim, and K. Suganuma, Effect of Ag Addition on the Microstructural and Mechanical Properties of Sn-Cu Eutectic Solder, Mater. R. Trans., 2002, 43, p 239–24510.2320/matertrans.43.239 ↗
23. T.L. Yang, J.J. Yu, W.L. Shih, C.H. Hsueh, and C.R. Kao, Effects of Silver Addition on Cu-Sn Microjoints for Chip-stacking Applications, J. Alloys Compd., 2014, 605, p 193–19810.1016/j.jallcom.2014.03.165 ↗
24. M.N. Bashir, A.S.M.A. Haseeb, A.Z.M.S. Rahman, and M.A. Fazal, Effect of Cobalt Doping on the Microstructure and Tensile Properties of Lead Free Solder Joint Subjected to Electromigration, J. Mater. Sci. Technol., 2016, 32, p 1129–113610.1016/j.jmst.2016.09.007 ↗
25. G. Vakanas, O. Minho, B. Dimcic, K. Vanstreels, B. Vandecasteele, I. De Preter, J. Derakhshandeh, K. Rebibis, M. Kajihara, I. De Wolf, and E. Beyne, Formation, Reprocessing and Characterization of Co-Sn Intermetallic Compounds for Potential Integration in 3D Interconnects, Microelectron. Eng., 2015, 140, p 72–8010.1016/j.mee.2015.04.116 ↗
26. C.D. Zou, Y.L. Gao, B. Yang, Q.J. Zhai, C. Andersson, and J. Liu, Melting Temperature Depression of Sn-0.4Co-0.7Cu Lead-Free Solder Nanoparticles, Solder Surf Mt Tech, 2009, 21, p 9–1310.1108/09540910910947417 ↗
27. J. Fan, Z. Liu, H. Zhai, X. Wang, Y. Wang, Y. Li, X. Zhou, S. Wu, and J. Liu, Effect of Co Content on the Microstructure, Spreadability, Conductivity and Corrosion Resistance of Sn-0.7Cu Alloy, Microelectron. Reliab., 2020, 107, p 11361510.1016/j.microrel.2020.113615 ↗
28. J. Fan, H. Zhai, Z. Liu, X. Wang, X. Zhou, Y. Wang, Y. Li, H. Gao, and J. Liu, Microstructure Evolution, Thermal and Mechanical Property of Co Alloyed Sn-0.7Cu Lead-Free Solder, J. Electron. Mater., 2020, 49, p 2660–266810.1007/s11664-020-07960-y ↗
29. J. Koo, C. Lee, S.J. Hong, K. Kim, and H.M. Lee, Microstructural Discovery of Al Addition on Sn-0.5Cu-based Pb-Free Solder Design, J. Alloys Compd., 2015, 650, p 106–11510.1016/j.jallcom.2015.08.003 ↗
30. L. Yang, Y. Zhang, C. Du, J. Dai, and N. Zhang, Effect of Aluminum Concentration on the Microstructure and Mechanical Properties of Sn-Cu-Al Solder Alloy, Microelectron. Reliab., 2015, 55, p 596–60110.1016/j.microrel.2014.12.017 ↗
31. M.A.A. Mohd Salleh, S.D. McDonald, H. Yasuda, A. Sugiyama, and K. Nogita, Rapid Cu6Sn5 Growth at Liquid Sn/solid Cu Interfaces, Scr. Mater., 2015, 100, p 17–2010.1016/j.scriptamat.2014.11.039 ↗
32. L. Yang, Y. Zhang, J. Da, Y. Jing, J. Ge, and N. Zhang, Microstructure, Interfacial IMC and Mechanical Properties of Sn-0.7Cu-xAl (x = 0-0.075) Lead-Free Solder Alloy, Mater. Des., 2015, 67, p 209–21610.1016/j.matdes.2014.11.036 ↗
33. H. Huang, G. Shuai, X. Wei, and C. Yin, Effects of sulfur addition on the wettability and corrosion resistance of Sn-0.7Cu lead-free solder, Microelectron. Reliab., 2017, 74, p 15–2110.1016/j.microrel.2017.05.010 ↗
34. K. Nogita, Stabilisation of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni Lead-Free Solder Alloys, Intermetallics, 2010, 18, p 145–14910.1016/j.intermet.2009.07.005 ↗
35. M.J. Rizvi, C. Bailey, Y.C. Chan, and H. Lu, Effect of Adding 0.3wt% Ni into the Sn-0.7wt%Cu Solder Part I: Wetting Behavior on Cu and Ni Substrates, J. Alloys Compd., 2007, 438, p 116–12110.1016/j.jallcom.2006.08.048 ↗
36. T. Maeshima, H. Ikehata, K. Terui, and Y. Sakamoto, Effect of Ni to the Cu Substrate on the Interfacial Reaction with Sn-Cu Solder, Mater. Des., 2016, 103, p 106–11310.1016/j.matdes.2016.04.068 ↗
37. M. Felberbaum, T. Ventura, M. Rappaz, and A.K. Dahle, Microstructure Formation in Sn-Cu-Ni Solder Alloys, Jom-Us, 2011, 63, p 52–5510.1007/s11837-011-0175-2 ↗
38. B.L. Silva, N. Cheung, A. Garcia, and J.E. Spinelli, Sn-0.7 wt%Cu-(xNi) Alloys: Microstructure-Mechanical Properties Correlations with Solder/Substrate Interfacial Heat Transfer Coefficient, J. Alloys Compd., 2015, 632, p 274–28510.1016/j.jallcom.2015.01.140 ↗
39. M.G.C. Xavier, C.B. Cruz, R. Kakitani, B.L. Silva, A. Garcia, N. Cheung, and J.E. Spinelli, Directional Solidification of a Sn-0.2Ni Solder Alloy in Water-Cooled Copper and Steel Molds: Related Effects on the Matrix Micromorphology, Nature of Intermetallics and Tensile Properties, J. Alloys Compd., 2017, 723, p 1039–105210.1016/j.jallcom.2017.06.329 ↗
40. J. Shen, Y. Pu, D. Wu, Q. Tang, and M. Zhao, Effects of Minor Bi, Ni on the Wetting Properties, Microstructures, and Shear Properties of Sn-07Cu Lead-Free Solder Joints, J. Mater. Sci.: Mater. Electron., 2015, 26, p 1572–1580
41. T. Ventura, S. Terzi, M. Rappaz, and A.K. Dahle, Effects of Ni Additions, Trace Elements and Solidification Kinetics on Microstructure Formation in Sn-0.7Cu Solder, Acta Mater., 2011, 59, p 4197–420610.1016/j.actamat.2011.03.044 ↗
42. B.L. Silva, N. Cheung, A. Garcia, and J.E. Spinelli, Thermal Parameters, Microstructure, and Mechanical Properties of Directionally Solidified Sn-0.7wt.%Cu Solder Alloys Containing 0 ppm to 1000 ppm Ni, J. Electron. Mater., 2013, 42, p 179–19110.1007/s11664-012-2263-7 ↗
43. H. Okamoto, M.E. Schlesinger, E.M. Mueller, ASM Handbook Volume 3 Alloy Phase Diagrams, ASM International Materials Park, Ohio (USA), 201610.31399/asm.hb.v03.9781627081634 ↗
44. C. Andersson, P. Sun, and J. Liu, Tensile Properties and Microstructural Characterization of Sn-07Cu-04Co Bulk Solder Alloy for Electronics Applications, J. Alloys Compd., 2008, 457, p 97–10510.1016/j.jallcom.2007.03.028 ↗
45. J. Bang, D. Yu, Y. Ko, M. Kim, H. Nishikawa, and C. Lee, Intermetallic Compound Formation and Mechanical Property of Sn-Cu-xCr/Cu Lead-Free Solder Joint, J. Alloys Compd., 2017, 728, p 992–100110.1016/j.jallcom.2017.09.011 ↗
46. J.W. Xian, S.A. Belyakov, T.B. Britton, and C.M. Gourlay, Heterogeneous Nucleation of Cu6Sn5 in Sn-Cu-Al Solders, J. Alloys Compd., 2015, 619, p 345–35510.1016/j.jallcom.2014.08.251 ↗
47. C.M.L. Wu, C.M.T. Law, D.Q. Yu, and L. Wang, The Wettability and Microstructure of Sn-Zn-RE Alloys, J. Electron. Mater., 2003, 32, p 63–6910.1007/s11664-003-0238-4 ↗
48. Y. Tang, S.M. Luo, W.F. Huang, Y.C. Pan, and G.Y. Li, Effects of Mn Nanoparticles on Tensile Properties of Low-Ag Sn-0.3Ag-0.7Cu-xMn Solder Alloys and Joints, J. Alloys Compd., 2017, 719, p 365–37510.1016/j.jallcom.2017.05.182 ↗
49. A. Ning, S. Jiang, and B. Peng, Mechanical Properties and Electrical Conductivity of Aluminum Alloys, Light Metals, 2005, 41, p 34–36