Effect of Sodium Dodecyl Sulfate on Mechanical Properties and Electrical Conductivity of Nanotwinned Copper
Source abstract
Abstract
A compound additive, gelatin (G) + sodium dodecyl sulfate (SDS), was firstly proposed to synthesize nanotwinned Cu with enhanced mechanical properties and electrical conductivity by direct current (DC) electrodeposition. The effect of compound additive in acid copper plating electrolyte on microstructure, nanoindentation hardness, tensile properties and electrical conductivity of electrodeposited copper was investigated. The optimum conditions of DC electrodeposition and deposition rate of electrodeposited copper were evaluated. The results show that the formation of nanotwins and the refinement of grains were enhanced after adding the 20 mg/L SDS + 15 mg/L G of compound additive, in return, which has a positive contribution to the enhanced mechanical properties and electrical conductivity. Tensile strength, hardness and the elongation to failure of electrodeposited Cu were 490 MPa, 1.79 GPa and 7.1%, respectively. The electrical conductivity was 97.4% IACS at room temperature. The enhancement mechanism of tensile properties and electrical conductivity was explained in view of high density of nanotwins.
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Research context
OpenAlex topics: Metal and Thin Film Mechanics · Electrodeposition and Electroless Coatings · Advanced materials and composites
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References (27)
Show source-provided references
1. A.M. Russell and K.L. Lee, Structure-Property Relations in Nonferrous Metals, Wiley, Hoboken, 200510.1002/0471708542 ↗
2. E.M.D. Pena and S. Roy, Electrodeposited Copper Using Direct and Pulse Currents from Electrolytes Containing Low Concentration of Additives, Surf. Coat. Technol., 2018, 339, p 101–11010.1016/j.surfcoat.2018.01.067 ↗
3. L. Lu, Y. Shen, and X.H. Chen, Ultrahigh Strength and High Electrical Conductivity in Copper, Science, 2004, 304, p 422–42610.1126/science.1092905 ↗
4. J. Ding, H. Zhao, L. Wang et al., Influence of Loading Directions on Dislocation Slip Mechanism of Nanotwinned Ni with Void Defect at the Twin Boundary, Comput. Mater. Sci., 2018, 152, p 1–1110.1016/j.commatsci.2018.05.026 ↗
5. X.H. Chen, Research Progress in Influence of Twins on Mechanical and Electrical properties of Cu, J. Mater. Eng., 2011, 9, p 87–91
6. L. Lu, X. Chen, X. Huang, and K. Lu, Revealing the Maximum Strength in Nanotwinned Copper, Science, 2009, 323, p 607–61010.1126/science.1167641 ↗
7. B.Z. Cui, K. Han, and Y. Xin, Highly Textured and Twinned Cu Films Fabricated by Pulsed Electrodeposition, Acta Mater., 2007, 55, p 4429–443810.1016/j.actamat.2007.04.009 ↗
8. Z.Y. Hu, J.L. Du, P.P. Wang et al., Insight into the Impact of Nanovoids on the Electrical and Mechanical Properties of Nanotwinned Copper Films, Scripta Mater., 2017, 137, p 41–4510.1016/j.scriptamat.2017.04.025 ↗
9. D.C. Bufford, Y.M. Wang et al., Synthesis and Microstructure of Electrodeposited and Sputtered Nanotwinned Face-Centered-Cubic Metals, MRS Bull., 2016, 41(4), p 286–29110.1557/mrs.2016.62 ↗
10. B. Yang, C.Y. Wang, and D.F. Li, Selective Separation of Copper and Cadmium from Zinc Solutions by Low Current Density Electrolysis, Trans. Nonferrous Met. Soc. China, 2010, 20(3), p 533–53610.1016/S1003-6326(09)60174-6 ↗
11. Y.J. Heng, Y.L. Peng, and K.E. Lang, Separation and Recovery of Cu and As from Copper Electrolyte Through Electrowinning and SO2 Reduction, Trans. Nonferrous Met. Soc. China, 2013, 23(7), p 2166–217310.1016/S1003-6326(13)62713-2 ↗
12. A. Rodchanarowan, P.K. Sarswat, and R. Bhide, Production of Copper from Minerals through Controlled and Sustainable Electrochemistry, Electrochim. Acta, 2014, 140, p 447–45610.1016/j.electacta.2014.07.015 ↗
13. S. Jin, C. Zhao, Q.S. Pan, and L. Lu, Effect of Electrolyte Additive Concentration on Microstructure of Direct-Current Electrodeposited Nanotwinned Cu, Acta Metall. Sin., 2016, 52(8), p 973–979
14. S. Jin, Q.S. Pan, and L. Lu, Microstructure Dependence of Direct Current Electrodeposited Bulk Cu with Preferentially Oriented Nanotwins on the Current Density, Acta Metall. Sin., 2013, 49(5), p 635–64010.3724/SP.J.1037.2013.00017 ↗
15. S. Li, Q. Zhu, B. Zheng et al., Nano-scale Twinned Cu with Ultrahigh Strength Prepared by Direct Current Electrodeposition, Mater. Sci. Eng., A, 2019, 758, p 1–610.1016/j.msea.2019.04.107 ↗
16. J.Q. Zhang, Effect of Deposition Parameters on Microstructure and Properties of Electroplated Nickel, Yangzhou University, Yangzhou, 2012
17. Z.K. Chen, Progress in Factors Study Affecting Deposition Overpotential During Copper Electrolysis, Hunan Nonferrous Met, 2015, 31(5), p 33–37
18. Y.C. Zhang, Electroplating Handbook, National Defense Industry Press, Beijing, 2011
19. Z. M. Tu, H. L. Hu, Y. C. Yu, P. Gao, Preparation Methods and Mechanisms of Electrodeposited Nanocrystalline Materials, Electroplating&Pollution Control, 2006, 26(4), p 4-8
20. P. Ganesan, S.P. Kumaraguru, B.N. Popov, Nanostructured Zn-Ni Alloys by Pulse Electrodeposition, Proceedings-AESF SUR/FIN Annual International Technical Conference, 2004, p 1064–1075
21. Y.W. Song and B. Zhao, The Influence of Additives on the Mechanical Properties of Chemical Plating Copper Layer, Chem. World, 2000, 41(1), p 13–18
22. B.B. Zhang, F.K. Yan, M.J. Zhao et al., Combined Strengthening from Nanotwins and Nanoprecipitates in an Iron-Based Superalloy, Acta Mater., 2018, 151, p 310–32010.1016/j.actamat.2018.04.001 ↗
23. W.C. Oliver and G.M. Pharr, Measurement of Hardness and Elastic Modulus by Instrumented Indentation: Advances in Understanding and Refinements to Methodology, J. Mater. Res., 2004, 19(1), p 3–2010.1557/jmr.2004.19.1.3 ↗
24. W.D. Callister, Fundamentals of Materials Science and Engineering, Vol 374, Wiley, Hoboken, 2001
25. I. Nakamichi, Electrical Resistivity and Grain Boundaries in Metals, Mater. Sci. Forum, 1996, 207–209, p 47–5810.4028/www.scientific.net/MSF.207-209.47 ↗
26. K.M. Mannan and K.R. Karim, Grain Boundary Contribution to the Electrical Conductivity of Polycrystalline Cu Films, J. Phys. F: Met. Phys., 1975, 5, p 1687–169310.1088/0305-4608/5/9/009 ↗
27. Y.F. Shen, L. Lu, X.H. Chen, L.H. Qian, and K. Lu, Ultrahigh Strength and High Electrical Conductivity of Copper with Nanometer Sized Twins, Physics, 2005, 34(5), p 344–347