Effect of Ni Addition to Sn0.7Cu Solder Alloy on Thermal Behavior, Microstructure, and Mechanical Properties

The addition of Ni on lead-free solder alloys Sn0.7Cu was tested in this study. A small amount of Ni was added to the solder alloys to evaluate the thermal behavior, microstructure, and mechanical properties of the composite solders after sintering and isothermal aging for 3 days and then compared with the results of the binary Sn0.7Cu solder. The results indicated that the ultimate tensile strength and yield tensile strength changed when adding 0.25 wt.% of Ni. The tested results of the differential scanning calorimeter showed that the addition of Ni (such as 0.5 and 1 wt.%) could obviously increase the solidification temperature of Sn0.7Cu alloys in the cooling process. When the Ni content was increased to 0.25 wt.% in the ternary condition, which includes the Sn0.7Cu-xNi (x = 0, 0.1, 0.25, 0.5, and 1 wt.%) solder alloys for the indentation creep test, the minimum creep rate reached the maximum; however, the trend was reversed as the Ni content was higher than this level. In addition, the microstructure of Sn-0.7Cu-xNi solder alloys was obviously different with the eutectic Sn-0.7Cu solder, such that the Ni gradually accumulated in the (Cu, Ni)6Sn5 IMCs within the Ni-containing solder alloys. Additionally, this process refined the microstructure of the Sn-0.7Cu solder. The fracture surface of the eutectic Sn-0.7Cu solder revealed ductile fracture modes; however, there was no mixed ductile–brittle fracture mode occurred when the Ni content was in the range of 0-1 wt.%.