Microstructure and Precipitate's Characterization of the Cu-Ni-Si-P Alloy

Microstructure of the Cu-Ni-Si-P alloy was investigated by transmission electron microscopy (TEM). The alloy had 551 MPa tensile strength, 226 HV hardness, and 36% IACS electrical conductivity after 80% cold rolling and aging at 450 °C for 2 h. Under the same aging conditions, but without the cold rolling, the strength, hardness, and electrical conductivity were 379 MPa, 216 HV, and 32% IACS, respectively. The precipitates identified by TEM characterization were δ-Ni2Si. Some semi-coherent spherical precipitates with a typical coffee bean contrast were found after aging for 48 h at 450 °C. The average diameter of the observed semi-coherent precipitates is about 5 nm. The morphology of the fracture surface was observed by scanning electron microscopy. All samples showed typical ductile fracture. The addition of P refined the grain size and increased the nucleation rate of the precipitates. The precipitated phase coarsening was inhibited by the small additions of P. After aging, the Cu-Ni-Si-P alloy can gain excellent mechanical properties with 804 MPa strength and 49% IACS conductivity. This study aimed to optimize processing conditions of the Cu-Ni-Si-P alloys.