Adhesion enhancement between colorless biphenyl polyimide copolymerized film and magnetron sputtering Cu for FPC circuit board
Source abstract
Abstract
Polyimide (PI) film is one of the world's leading thin film insulation materials, which can be used in electronic applications in the aerospace, medical, and automotive industries.
Only a short abstract or summary was supplied by the source.
Source: crossref · Quality: short
Research context
OpenAlex topics: Synthesis and properties of polymers · Polymer Science and PVC · Electronic Packaging and Soldering Technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
School of Chemical Engineering, University of Science and Technology Liaoning, Anshan 114051, China
School of Chips, XJTLU Entrepreneur College (Taicang), Xi’an Jiaotong-Liverpool University, Taicang, Suzhou, 215400, China
Funding
Scientific Research Fund of Liaoning Provincial Education Department · National Natural Science Foundation of China
References (31)
Show source-provided references
1. Zhang · ACS Appl. Mater. Interfaces · 2025 · 17 · 1735810.1021/acsami.4c22198 ↗
2. Wang · ACS Appl. Mater. Interfaces · 2022 · 14 · 569910.1021/acsami.1c18866 ↗
3. Li · Polymer · 2022 · 254 · 12507810.1016/j.polymer.2022.125078 ↗
4. Fang · Polym. Chem. · 2022 · 13 · 510510.1039/D2PY00732K ↗
5. A.Deshpande , E.Pourshaban , C.Ghosh , et al. , Adhesion strength of PDMS to polyimide bonding with thin-film silicon dioxide; proceedings of the 2021 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), F, 2021 [C], IEEE
6. Cen-Puc · Polymers · 2021 · 13 · 195510.3390/polym13121955 ↗
7. Ogbonna · Polym. Bull. · 2022 · 79 · 66310.1007/s00289-020-03487-8 ↗
8. Wan · Adv. Mater. · 2023 · 35 · 230118510.1002/adma.202301185 ↗
9. Zhao · Compos. Sci. Technol. · 2024 · 245 · 11032310.1016/j.compscitech.2023.110323 ↗
10. Qin · Sens. Actuators, B · 2022 · 373 · 13269910.1016/j.snb.2022.132699 ↗
11. Martins · Opt. Laser Technol. · 2023 · 160 · 10904710.1016/j.optlastec.2022.109047 ↗
12. S.Ando , I.Tomita and K.Takagi , Polymers for Optical Communications , CRC Press , 2025
13. Li · Polymers · 2024 · 16 · 231510.3390/polym16162315 ↗
14. Wang · Polymers · 2024 · 16 · 159110.3390/polym16111591 ↗
15. Liu · J. Appl. Polym. Sci. · 2022 · 139 · e5260410.1002/app.52604 ↗
16. Liu · Energy Environ. Sci. · 2022 · 15 · 5610.1039/D1EE03186D ↗
17. Zhang · Nano-Micro Lett. · 2023 · 15 · 13510.1007/s40820-023-01104-7 ↗
18. Kareem · Polym. Bull. · 2022 · 79 · 661710.1007/s00289-021-03830-7 ↗
19. Kuliasha · Adv. Mater. Technol. · 2021 · 6 · 210014910.1002/admt.202100149 ↗
20. Zhang · ACS Appl. Polym. Mater. · 2022 · 4 · 822710.1021/acsapm.2c01180 ↗
21. He · Compos. Sci. Technol. · 2025 · 261 · 11100610.1016/j.compscitech.2024.111006 ↗
22. Bai · RSC Adv. · 2021 · 11 · 2380210.1039/D1RA02765D ↗
23. Chen · ACS Appl. Mater. Interfaces · 2025 · 17 · 1601610.1021/acsami.4c21102 ↗
24. Hu · J. Mater. Res. Technol. · 2022 · 18 · 432910.1016/j.jmrt.2022.04.101 ↗
25. Shen · Polymer · 2022 · 254 · 12505010.1016/j.polymer.2022.125050 ↗
26. Yin · Membranes · 2022 · 12 · 59210.3390/membranes12060592 ↗
27. Ai · Nano Res. · 2024 · 17 · 774610.1007/s12274-024-6765-4 ↗
28. Li · Prog. Org. Coat. · 2022 · 172 · 10710310.1016/j.porgcoat.2022.107103 ↗
29. Wu · Polymers · 2022 · 14 · 126910.3390/polym14061269 ↗
30. Dong · Microsyst. Nanoeng. · 2023 · 9 · 3110.1038/s41378-023-00503-5 ↗
31. Lei · Polym. Chem. · 2022 · 13 · 660610.1039/D2PY01325H ↗