Heat-stimulated lifetime-controllable encapsulation for transient electronics
Source abstract
Abstract
Life-control of transient electronics is enabled by applying a polymer/fatty acid composite film as the encapsulating material. Polymeric encapsulating materials developed can be degraded by mild thermal triggers without toxic products.
Only a short abstract or summary was supplied by the source.
Source: crossref · Quality: short
Research context
OpenAlex topics: Semiconductor materials and devices · Parallel Computing and Optimization Techniques · Advancements in Semiconductor Devices and Circuit Design
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Department of Chemical Engineering, Konkuk University, 120 Neungdong-ro, Gwangjin-gu, Seoul 05029, Republic of Korea
Funding
National Research Foundation of Korea
References (39)
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