Design of metalized polyether-ether-ether-ketone based on semi-additive manufacture for 5G applications: from bottom-up assembly to selective electroplating
Source abstract
Abstract
Based on semi-additive manufacture, PEEK with a nanoscale profile integrated tightly with electrodeposited thick copper through the surface modification of GPTMS assembly.
Only a short abstract or summary was supplied by the source.
Source: crossref · Quality: short
Research context
OpenAlex topics: 3D IC and TSV technologies · Electronic Packaging and Soldering Technologies · Additive Manufacturing and 3D Printing Technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Department of Materials Science, Fudan University, Shanghai 200438, China
Yiwu Research Institute of Fudan University, Yiwu City, Zhejiang 322000, China
Zhongshan-Fudan Joint Innovation Center, Zhongshan City, Guangdong 528437, China
Funding
National Natural Science Foundation of China · Natural Science Foundation of Shanghai Municipality · Fudan University
References (42)
Show source-provided references
1. Ogunseitan · Nat. Rev. Mater. · 2022 · 7 · 74910.1038/s41578-022-00485-2 ↗
2. Immonen · Materials · 2022 · 15
3. Perdigones · Micromachines · 2022 · 13
4. He · Plat. Surf. Finish. · 2013 · 35 · 27
5. Li · Chem. Eng. J. · 2021 · 416
6. Wu · Adv. Sci. · 2023 · 10
7. Zeng · Nanoscale · 2022 · 14 · 1600310.1039/D2NR03990G ↗
8. Duan · J. Mater. Chem. C · 2023 · 11 · 558510.1039/D3TC00016H ↗
9. Arif · Asian J. Pharm. Sci. · 2023 · 18
10. Saadi · Adv. Mater. · 2022 · 34
11. Fu · Prog. Polym. Sci. · 2022 · 126
12. Zhou · Fractal Fract. · 2022 · 6
13. Salazar · Addit. Manuf. · 2022 · 51
14. Escorcia-Díaz · Nanomaterials · 2023 · 13
15. Li · ACS Appl. Mater. Interfaces · 2023 · 15 · 1259010.1021/acsami.2c23144 ↗
16. Zhong · Adv. Mater. Interfaces · 2022 · 9
17. Wang · Composites, Part B · 2019 · 157 · 12310.1016/j.compositesb.2018.08.030 ↗
18. Luo · Constr. Build. Mater. · 2023 · 372
19. Huang · Chem. Eng. J. · 2020 · 383
20. Lee · Materials · 2022 · 15
21. Hur · Colloids Surf., A · 2022 · 645
22. Liu · Compos. Sci. Technol. · 2023 · 233
23. Liu · Electron. Commun. Eng. J · 1990 · 2 · 10910.1049/ecej:19900029 ↗
24. Zhang · IEEE Trans. Electromagn. Compat. · 2023 · 65 · 124710.1109/TEMC.2023.3266031 ↗
25. Cai · Engineering · 2022 · 14 · 18110.1016/j.eng.2022.02.012 ↗
26. Wang · ACS Appl. Mater. Interfaces · 2019 · 11 · 4481110.1021/acsami.9b11690 ↗
27. Wang · J. Mol. Liq. · 2023 · 390
28. Samal · Appl. Surf. Sci. · 2023 · 614
29. Chiter · Corros. Sci. · 2022 · 209
30. Luo · Appl. Surf. Sci. · 2023 · 613
31. Li · Appl. Surf. Sci. · 2022 · 602
32. Liu · Corros. Sci. · 2023 · 212
33. Huang · Chem. Eng. J. · 2021 · 418
34. Duan · J. Mater. Chem. A · 2020 · 8 · 739510.1039/C9TA13574J ↗
35. Karna · Prog. Org. Coat. · 2023 · 176
36. Sengokmen-Ozsoz · ACS Appl. Mater. Interfaces · 2023 · 15 · 3076910.1021/acsami.3c04637 ↗
37. Bai · Mater. Chem. Phys. · 2003 · 79 · 4910.1016/S0254-0584(02)00455-8 ↗
38. Tan · J. Colloid Interface Sci. · 2021 · 585 · 28710.1016/j.jcis.2020.11.059 ↗
39. Qu · Carbon · 2023 · 201 · 3710.1016/j.carbon.2022.08.071 ↗
40. Ravi · Colloids Surf., A · 2023 · 661
41. Vlahović · Appl. Catal., B · 2023 · 334
42. Salahshoori · ACS Appl. Mater. Interfaces · 2023 · 15 · 3118510.1021/acsami.3c03943 ↗