Moisture resistance evaluation on single electronic package moulding compound
Source abstract
Abstract
Non-destructive evaluation indices that correlate with the moisture resistance of integrated circuit packages are developed.
Only a short abstract or summary was supplied by the source.
Source: crossref · Quality: short
Research context
OpenAlex topics: Material Properties and Processing · Electronic Packaging and Soldering Technologies · Additive Manufacturing and 3D Printing Technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Center for Reliability Sciences and Technologies
Chang Gung University
Taoyuan 33302
Taiwan
Department of Electronic Engineering
Department of Physics
Faculty of Science
National University of Singapore
Singapore
CL Technology Co., Limited
New Taipei
References (51)
Show source-provided references
1. D. D. Lu and C. P.Wong , Materials for advanced packaging , New York , Springer , 200910.1007/978-0-387-78219-5 ↗
2. H. Ardebili and M.Pecht , Encapsulation Technologies for Electronic Applications , Elsevier , 2009
3. G. Q. Xhang , W. D.van Driel and X. J.Fan , Mechanics of Microelectronics , Springer , New York, NY , 2006 , vol. 9
4. X. Fan , Electronic Component Technology Conference (ECTC) Professional Development Course Handout , 2008 , pp. 1–92
5. Bond · Appl. Mech. Rev. · 2006 · 59 · 24910.1115/1.2202873 ↗
6. Galloway · IEEE Trans. Compon., Packag., Manuf. Technol., Part A · 1997 · 20 · 27410.1109/95.623021 ↗
7. Shook · IEEE Trans. Compon., Packag., Manuf. Technol., Part B · 1996 · 19 · 11010.1109/3476.507147 ↗
8. X. Fan , J.Zhou and A.Chandra , Electronic Components and Technology Conference , 2008 , pp. 1054–1066
9. Harsányi · Microelectron. Reliab. · 1999 · 39 · 140710.1016/S0026-2714(99)00079-7 ↗
10. T. L. Welsher , J. P.Mitchell and D. J.Lando , IEEE Proceedings of International Reliability Physics Symposium , 1980 , pp. 235–237
11. Ferguson · J. Electron. Packag. · 2002 · 124 · 10610.1115/1.1414133 ↗
12. K. Moon , S. D.Hwang , H.Yoon , J. H.Ryu and S. S.Woo , IEEE/CPMT Electronics Packaging Technology Conference , 1998 , pp. 318–324
13. Pereira · Polimeros · 2016 · 26 · 3010.1590/0104-1428.2106 ↗
14. Soles · J. Polym. Sci., Part B: Polym. Phys. · 2000 · 38 · 79210.1002/(SICI)1099-0488(20000301)38:5<792::AID-POLB16>3.0.CO;2-H ↗
15. Carfagna · J. Appl. Polym. Sci. · 1982 · 27 · 10510.1002/app.1982.070270112 ↗
16. Morgan · J. Appl. Polym. Sci. · 1987 · 33 · 99910.1002/app.1987.070330401 ↗
17. J. K. Fauty , Moisture Sensitivity of Plastic Packages of IC Devices , 2010 , pp. 359–388
18. JEDEC Standard-JESD22-A102E, http://www.jedec.org
19. A.-K. Shednletsky , The New Manufacturing KPI That No One Is Talking About: Amazon Reviews, https://www.forbes.com/sites/annashedletsky/2018/08/28/the-new-manufacturing-kpi-that-no-one-is-talking-about-amazon-reviews/#2fe27a1e1064
20. C. Kradjel and K. A.Lee , NIR Analysis of Polymers, Handbook of Near-Infrared analysis , CRC Press , Boca Raton , 2008 , p. 547
21. C. Kradjel , The Pittsburgh conference on Analytical Chemistry and Applied Spectroscopy , New Orleans, LA , 1987
22. Billaud · Appl. Spectrosc. · 2002 · 56 · 141310.1366/00037020260377706 ↗
23. Hill · Polym. Adv. Technol. · 2002 · 13 · 35310.1002/pat.198 ↗
24. Nicolet™ iN™ 10 Infrared Microscope. Nicolet™ iN™ 10 Infrared Microscope, https://www.thermofisher.com/order/catalog/product/IQLAADGAAGFAHDMAPD , accessed 30 July 2019
25. S. H. Goodman , Handbook of Thermoset Plastics , Noyes Publication , USA , 1998
26. Nikolic · Sensors · 2010 · 10 · 68410.3390/s100100684 ↗
27. W. C. Mih , Polymers in Electronics , ACS Symposium Series , 1984 , vol. 242, pp. 273–283
28. Cabanelas · J. Mater. Process. Technol. · 2003 · 143–144 · 31110.1016/S0924-0136(03)00480-1 ↗
29. J. Murphy , Additives for Plastics Handbook , Elsevier , 2001
30. K. Hodd , Comprehensive Polymer Science and Supplements , 1989
31. Pearson · Polymer · 1993 · 34 · 365810.1016/0032-3861(93)90051-B ↗
32. A. Apicella and L.Nicolais , Advance Polymer Science , 1985 , pp. 69–77
33. Merdas · Polymer · 2002 · 43 · 461910.1016/S0032-3861(02)00267-7 ↗
34. Mijović · Macromolecules · 2003 · 36 · 127910.1021/ma021568q ↗
35. Lefebvre · J. Adhes. Sci. Technol. · 2000 · 14 · 92510.1163/156856100742988 ↗
36. R. O. Ebewele , Polymer Science and Technology , CRC press , 2000 , vol. 7410.1201/9781420057805 ↗
37. Menger · Langmuir · 2005 · 21 · 268910.1021/la040113m ↗
38. R. B. Silverman and M. W.Holladay , The Organic Chemistry of Drug Design and Drug Action , Academic Press , 3rd edn, 2014 , pp. 165–205
39. Wang · Nucl. Instrum. Methods Phys. Res., Sect. B · 2010 · 268 · 235510.1016/j.nimb.2010.04.010 ↗
40. Li · Corros. Sci. · 2009 · 51 · 300010.1016/j.corsci.2009.08.029 ↗
41. Aromatic Hydrocarbon, https://courses.lumenlearning.com/boundless-chemistry/chapter/aromatic-hydrocarbons/
42. Crank · Diffus. Polym. · 1968 · 23 · 1
43. M. Chaplin , Infrared Spectroscopy , 2013
44. G. Socrates , Infrared and Raman Characteristic Group Frequencies , John Wiley & Sons, Ltd , 2001
45. Blanco · J. Appl. Polym. Sci. · 2006 · 100 · 488010.1002/app.23276 ↗
46. Cotugno · Macromolecules · 2005 · 38 · 80110.1021/ma040008j ↗
47. Grave · J. Appl. Polym. Sci. · 1998 · 69 · 236910.1002/(SICI)1097-4628(19980919)69:12<2369::AID-APP8>3.0.CO;2-6 ↗
48. Rekkab-Hammoumraoui · Bull. Mater. Sci. · 2011 · 34 · 112710.1007/s12034-011-0157-6 ↗
49. Tan · J. Membr. Sci. · 2016 · 514 · 59510.1016/j.memsci.2016.05.026 ↗
50. D. C. Montgomery , Introduction to Statistical Quality Control , John Wiley & Sons , 2007
51. IPCStandard , IPC Association Connecting Electronics Industries , 2014