Theoretical screening of Co- and Mo-based binary alloys as interconnect metals
Source abstract
Abstract
This work presents the candidate screening procedure of binary intermetallic compounds for future metal interconnects using cohesive energy, and directionally averaged figure of merit.
Only a short abstract or summary was supplied by the source.
Source: crossref · Quality: short
Research context
OpenAlex topics: Copper Interconnects and Reliability · Semiconductor materials and interfaces · Electrodeposition and Electroless Coatings
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Department of System Semiconductor Engineering, Yonsei University, Seoul 03722, South Korea
Funding
National Research Foundation of Korea · Ministry of Trade, Industry and Energy
References (27)
Show source-provided references
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