DataVX3D Printing and Additive ManufacturingPaper
journal article·2024-02-01Open access

Rapid Volumetric Additive Manufacturing in Solid State: A Demonstration to Produce Water-Content-Dependent Cooling/Heating/Water-Responsive Shape Memory Hydrogels

Abhijit Vijay Salvekar, Faqrul Hasif Bin Abdul Nasir, Ya Hui Chen, Sharanya Maiti, Vivek Damodar Ranjan, Hong Mei Chen, Han Wang, Wei Min Huang

3D Printing and Additive Manufacturing· Volume 11· Issue 1
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Source abstract

Abstract

In this study, we demonstrate the feasibility of rapid volumetric additive manufacturing in the solid state. This additive manufacturing technology is particularly useful in outer space missions (microgravity) and/or for harsh environment (e.g., on ships and vehicles during maneuvering, or on airplanes during flight). A special thermal gel is applied here to demonstrate the concept, that is, ultraviolet crosslinking in the solid state. The produced hydrogels are characterized and the water-content-dependent heating/cooling/water-responsive shape memory effect is revealed. Here, the shape memory feature is required to eliminate the deformation induced in the process of removing the uncrosslinked part from the crosslinked part in the last step of this additive manufacturing process.
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Research context

PolymersMaterials processing

OpenAlex topics: Polymer composites and self-healing · Advanced Materials and Mechanics · Additive Manufacturing and 3D Printing Technologies

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore, Singapore.

School of Physical Science and Technology, Soochow University, Suzhou, China.

Department of Manufacturing Engineering, School of Mechanical Engineering, Vellore Institute of Technology, Vellore, Tamil Nadu, India.

College of Chemistry and Materials Science, Sichuan Normal University, Chengdu, China.

Guangdong Provincial Key Laboratory of Micro-Nano Manufacturing Technology and Equipment, School of Electromechanical Engineering, Guangdong University of Technology, Guangzhou, China.

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