Study on the effect of atmosphere sintering on the performance of multilayer chip power inductor

With the development of switching power supply and electronic technology, the demand for portable electronics is constantly moving towards miniaturization, high-frequency, and low-power loss. This demand has put forward new requirements and challenges for the performance of multilayer chip power inductor. FeSiCr iron-based soft magnetic materials are widely used in the preparation of high-quality multilayer chip power inductor due to their higher magnetic permeability, quality factor Q, and oxidation resistance. However, the sintering conditions of the FeSiCr material have a significant impact on the performance of the multilayer chip power inductor. Currently, few of the reported study have considered the influence of oxygen partial pressure on the performance of multilayer alloy chip power inductor during sintering process. This paper studied the influencing factors of atmosphere sintering pretreatment temperature and time, sintering temperature and oxygen partial pressure during sintering process, based on the multilayer chip power inductor with the size of 201610. The formation mechanism of the influence curves has been comprehensively analyzed theoretically, and Maxwell FEM simulation was used to obtain the magnetic density distribution of the inductor. Finally, the best sintering conditions of the FeSiCr multilayer chip power inductor have been found. According to the comparative experimental under different sintering conditions, the following conclusions can been obtained: the appropriate adhesive discharge temperature and time are 350℃ and 60 minutes, respectively, the optimal sintering temperature is around 750 ℃, the optimal temperature rise rate is 5℃/min. While the oxygen partial pressure is about 6.5%, the multilayer inductor can obtain excellent electrical properties.