New polishing method using water-based slurry under AC electric field for glass substrate

We proposed an AC electric field-assisted novel polishing method for borosilicate glass plate with water-based slurry. It has been found that the applied electric field operates effectively in positioning the slurry with abrasives in the polishing area. In-situ observations also confirmed that the AC electric field affected the motion of slurry. Under optimal polishing conditions, the processing time of borosilicate glass plate was shortened compared to AC electric field free conditions. Furthermore, the polishing removal amount was increased from 14 to 22 μm for a polishing time of 30 min. This suggests that the productivity could be enhanced by 1.5 times by applying electric field during polishing.