Challenges in using photosensitive embedding material to planarize multi-layer coils for actuator systems

Microfabricated electromagnetic actuators require substantial building heights. Fabricating such devices not only demands great resist thicknesses for forming micromolds for electroplating, but also embedding technologies for creating intermediate planes. This paper investigates the process for producing embedding layers using the epoxy-based photoresist SU-8. The results were applied towards the integration of multi-layer coils in a high aspect ratio electromagnetic microactuator.