journal article·2024-03

Influence of room-temperature oxidation on stability and performance of reactively sputtered TaN thin films for high-precision sheet resistors

Mingzhen Zhang, Yue Wang, Shangzhi Song, Ruiqiang Guo, Wenbin Zhang, Chengming Li, Junjun Wei, Puqing Jiang, Ronggui Yang

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OpenAlex topics: Metal and Thin Film Mechanics · Semiconductor materials and devices · Diamond and Carbon-based Materials Research

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References (32)

Show source-provided references
1. Wear and corrosion characteristics of nano-crystalline tantalum nitride coatings deposited on CoCrMo alloy for hip joint applications10.1016/j.matchar.2021.111516 ↗
2. Structural properties and corrosion resistance of tantalum nitride coatings produced by reactive DC magnetron sputtering10.1039/C6RA17869C ↗
3. Comparative study of tantalum and tantalum nitrides (Ta2N and TaN) as a diffusion barrier for Cu metallization10.1116/1.588818 ↗
4. Diffusion barrier properties of single- and multilayered quasi-amorphous tantalum nitride thin films against copper penetration10.1063/1.373566 ↗
5. Characterization of tantalum nitride thin films deposited on SiO2 ∕ Si substrates using dc magnetron sputtering for thin film resistors10.1149/1.2146861 ↗
6. Stability of tantalum nitride thin film resistors10.1557/JMR.1990.1224 ↗
7. Reactive sputter deposition and properties of TaxN thin films10.1016/S0167-9317(02)00801-8 ↗
8. Structural and electrical properties of tantalum nitride thin films fabricated by using reactive radio-frequency magnetron sputtering10.1007/s003390000691 ↗
9. Reactive sputter deposition and characterization of tantalum nitride thin films10.1016/S0921-5107(98)00417-6 ↗
10. Stable and metastable structures of the multiphase tantalum nitride system10.1103/PhysRevB.71.024111 ↗
11. Control of electrical resistivity of TaN thin films by reactive sputtering for embedded passive resistors10.1016/j.tsf.2007.08.027 ↗
12. Electrical and mechanical properties of tantalum nitride thin films deposited by reactive sputtering10.1016/j.jcrysgro.2005.06.017 ↗
13. Effect of nitrogen flow ratio on nano-mechanical properties of tantalum nitride thin film10.1016/j.jallcom.2017.05.159 ↗
14. Effects of nitrogen composition on the resistivity of reactively sputtered TaN thin films10.1002/sia.5691 ↗
15. Influence of nitrogen concentration on electrical, mechanical, and structural properties of tantalum nitride thin films prepared via DC magnetron sputtering10.1007/s00339-022-05501-4 ↗
16. Effect of bias voltage on microstructure and properties of tantalum nitride coatings deposited by RF magnetron sputtering10.3390/coatings11080911 ↗
17. Influence of substrate temperature and N2/Ar flow ratio on the stoichiometry, structure and hardness of TaNx coatings deposited by DC reactive sputtering10.1002/sia.5808 ↗
18. Effect of deposition and annealing temperature on mechanical properties of TaN film10.1016/j.apsusc.2011.08.116 ↗
19. The impact of substrate properties and thermal annealing on tantalum nitride thin films10.1016/j.apsusc.2011.11.003 ↗
20. Effects of processing parameters on the properties of tantalum nitride thin films deposited by reactive sputtering10.1016/j.jallcom.2007.10.027 ↗
21. Study of phase transition and electrical resistivity of tantalum nitride films prepared by DC magnetron sputtering with OES detection system10.1016/S0040-6090(01)01342-6 ↗
22. Structural modification of tantalum crystal induced by nitrogen ion implantation10.1007/s12034-016-1212-0 ↗
23. Thermal oxidation and resistivity of tantalum nitride films10.1016/0040-6090(80)90383-1 ↗
24. Characterization of the oxidation of tantalum nitride10.1002/sia.740200703 ↗
25. Thermal stability of tantalum nitride based thin film resistors
26. High temperature thermal properties of thin tantalum nitride films10.1063/1.3672098 ↗
27. Reliability and characteristics of magnetron sputter deposited tantalum nitride for thin film resistors10.1016/j.tsf.2018.04.016 ↗
28. Moulder · 1992 · 170
29. Thin and low-resistivity tantalum nitride diffusion barrier and giant-grain copper interconnects for advanced ULSI metallization10.1143/JJAP.38.2401 ↗
30. Logarithmic sensitivity ratio elucidates thermal transport physics in multivariate thermoreflectance experiments
31. CRC Handbook of Chemistry and Physics, Available from: , 2003-2004, pp. 4–133.
32. Characterization of Ta and TaN diffusion barriers beneath Cu layers using picosecond ultrasonics10.1016/j.ultras.2006.05.097 ↗