journal article·2025-04

Unveiling the uniform copper thickening mechanism of micro through-hole using 4,7,10-trioxa-1,13-tridecanediamine as a novel and single additive in an acidic electroplating bath

Yi-Long Liu, Yi Zhao, Si-Yu Chen, Jia-Qiang Yang, Xin-Yu Wang, Ren Hu, Fang-Zu Yang, DongPing Zhan

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OpenAlex topics: Electrodeposition and Electroless Coatings · Electrochemical Analysis and Applications · Corrosion Behavior and Inhibition

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