Superhard nanocrystalline Ti–Cu–N coatings deposited by vacuum arc evaporation of a sintered cathode

Abstract Experimental data are presented on the structure and properties of hardening nanocrystalline copper-added titanium nitride coatings produced by plasma-assisted vacuum arc evaporation of sintered cathodes. A model of the nanostructurization of this type of coating is proposed. According to the model, the nanocrystallization in these materials is due to the added atoms, which form an amorphous sheath around a grain that restricts the grain growth.