journal article·2026-02-01

High-speed welding of copper wires by high-power coaxial blue-IR hybrid laser with galvanometer scanner

T. Kikuchi, R. Kokubo, T. Kondo, H. Kaminaga, M. Watanabe, H. Ikenoue, D. Nakamura

Journal of Laser Applications· Volume 38· Issue 1
Publisher page

Abstract

A hybrid laser welding system was developed to enable high-speed, spatter-suppressed joining of pure copper conductors, aimed at applications such as electric motor manufacturing. The system combines a 2 kW infrared (IR) single-mode fiber laser with a 3 kW blue diode laser, along with a high-speed galvanometer scanner for precise beam control. The blue laser, exhibiting high absorption in solid copper, initiates rapid surface melting, while the IR laser efficiently forms a keyhole by leveraging enhanced absorption in the liquid phase. Experiments on 2 × 4 mm copper wires revealed that increasing the scan speed reduced weld size, primarily due to decreased energy absorption associated with shallower keyhole formation. Spatter evaluation using high-speed imaging showed a significant reduction in spatter at higher scan speeds. A scan speed of 1500 mm/s was identified as optimal, achieving a weld length of 2 mm within 0.15 s while minimizing spatter. These results demonstrate the effectiveness of the hybrid laser configuration in achieving efficient, high-quality copper welding suitable for high-throughput industrial applications.
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Research context

OpenAlex topics: Welding Techniques and Residual Stresses · Laser Material Processing Techniques · Advanced Welding Techniques Analysis

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Kyushu University 1 Graduate School of Information Science and Electrical Engineering, , 744 Motooka, Nishi-ku, Fukuoka 819-0395,

Tamari Industry Co., Ltd. 2 , 1-1 Gorouta, Nishio City, Aichi 445-0802,

Kochi University of Technology 3 Graduate School of Information Science and Electrical Engineering, , 185 Miyanokuchi, Tosayamada, Kami City, Kochi 782-8502,

Funding

Adaptable and Seamless Technology Transfer Program through Target-Driven R and D

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