An alternative micro-area X-ray diffraction method for residual stress measurement of Pb(Zr,Ti)O3 film

Abstract An alternative X-ray diffraction method for micro-area residual stress measurement was proposed by means of the analysis of a single diffraction ring, which was performed on a laboratory X-ray microdiffraction system equipped with a 2D planar detector. The microdiffraction experiments were employed to evaluate the residual stress in sol–gel-derived Pb(Zr,Ti)O 3 film before and after Ag electrode deposition. The tensile stresses of about 2.3 GPa and 1.2 GPa were calculated in the micro-area of film without and with electrode, which was related to a top electrode stress relaxation effect.