journal article·2018-05-01

On the quality and the accuracy of the laser direct structuring, experimental investigation and optimization

Bassim Bachy, Robert Süß-Wolf, Jörg Franke

Journal of Laser Applications· Volume 30· Issue 2
Publisher page

Abstract

The enormous applications of the molded interconnect devices (MID) make these face many difficult challenges, some of which are the quality and the reliability, as well as concerns on how to produce the micro-MID products. This drives to a hard competition between the different methods used in the MID technology. The laser direct structuring (LDS) has clearly been distinguished as the best method in comparison with the other MID processes. However, it also needs more development, especially in terms of the quality, accuracy, and their impact on the final MID quality of the two- (2D) and three-dimensional (3D) micro and normal products, especially with the decline or the limited availability of information in both of the industry and scientific research. In this work, the MID-LDS has been experimentally investigated by considering the effect of the important process parameters on the process responses and then to explore the relationship between these responses and the final MID quality and reliability. These experimental works were based on the design of the experimental tool, which employed a full factorial design for the LDS process parameters. They include the laser power, structuring speed, laser frequency, hatching percentage, the incident angle, and the focal length. The experiments have been performed on the polymer plates of Poly Ether Ether Ketone (PEEK) materials. During the experiments, different measurements have been implemented to find out the correlation between the adopted parameters and the 3D surface roughness, structuring percentage, structuring type, and ablation type, which are regarded as the most important features of LDS quality. Further measurements focus on the LDS accuracy and the final quality and reliability of the metallization structure, which includes the metallization thickness, the surface roughness, and the adhesion strength. The analysis of these experimental results showed that the quality and reliability, especially the adhesion strength and the surface roughness, of the final MID products are deeply related to the structuring percentage, structuring type, ablation type, and finally, the surface roughness.
Source: crossref · Quality: baseline

Research context

OpenAlex topics: Laser Material Processing Techniques · Advanced machining processes and optimization · Additive Manufacturing Materials and Processes

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Institute for Factory Automation and Production Systems, Friedrich-Alexander University Erlangen-Nürnberg, Fürther Straße 246b 1 , 90429 Nürnberg, Germany

Department of Mechanical, College of Engineering, University of Baghdad 2 , Iraq-Baghdad-Aljadria, P.O. Box 47024

References (20)

Show source-provided references
1. 2014
2. Kinematic analysis and simulation of MID laser direct structuring equipment10.4028/www.scientific.net/AMR.590.236 ↗
3. Simulation of laser structuring by three dimensional heat transfer model
4. Simulation and experimental investigation for the 2D and 3D laser direct structuring process10.14257/ijast.2016.89.01 ↗
5. Modeling and optimization of laser direct structuring process using artificial neural network and response surface methodology10.5267/j.ijiec.2015.4.003 ↗
6. Manufacturing of molded interconnect devices from prototyping to mass production with laser direct structuring
7. Laser supported activation and additive metallization of thermoplastics for 3D-MIDs
8. Experimental investigation and optimization for the effective parameters in the laser direct structuring process10.2961/jlmn.2015.02.0018 ↗
9. K. A. Nowakowski, “Laser beam interaction with materials for microscale applications,” Doctoral dissertation, Draper Laboratory, Cambridge, 2005.
10. See http://www.lpkf.de/produkte/mid/fusion3d-1100.htm for “LPKF Laser and Electronics: LPKF Fusion3D 1100,” Technical Information (last accessed 1 March 2017).
11. LPKF Laser and Electronics · 2015
12. Process chains for the manufacturing of molded interconnect devices10.1007/s00170-008-1660-9 ↗
13. 2016
14. Aluminium wedge-wedge wire bonding on thermoplastic substrates made by LPKF-LDS® technology
15. C. Goth and R. Michael, http://www.harting-mitronics.ch for “External current-free, chemical metallization” (last accessed 1 March 2017).
16. Laser supported activation and additive metallization of thermoplastics for 3D-MIDs
17. Hot pin pull method—New test procedure for the adhesion measurement for 3D-MID10.4028/www.scientific.net/AMR.1038.115 ↗
18. J. Kostakos, “Relation between surface roughness and adhesion as studied with AFM,” Ph.D thesis, University of Twente, 2013.
19. Laser-induced selective metal plating on PP and PC/ABS polymers surface
20. Investigation of adhesion strength of metallization on thermoplastic and ceramic substrates