Laser-enhanced electroless plating of silver seed layers for selective electroless copper deposition
Source abstract
Abstract
Copper (Cu) has been patterned using a laser direct-write metallization technique for fabrication of printed wiring boards. The approach consists of writing a silver (Ag) seed layer with a subsequent step of electroless Cu plating to increase thickness and electrical conductivity. Ag seed layers were patterned with a frequency tripled Nd:YVO4 (λ=355 nm) laser with a spot size of approximately 50 μm. Final Cu linewidths after electroless plating were found to be 150 μm with a thickness of 2 μm and electrical resistivity of 5 μΩ cm. An optimal laser power of 0.81 W was found by a factorial-type design experiment. A modern prototype circuit was also patterned with this technique, demonstrating its compatibility with current resolution requirements.
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Research context
OpenAlex topics: Electrodeposition and Electroless Coatings · Copper Interconnects and Reliability · Semiconductor materials and devices
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Department of Materials Science and Engineering, The Pennsylvania State University, University Park, Pennsylvania 16802
Applied Research Laboratory, The Pennsylvania State University, University Park, Pennsylvania 16802
References (33)
Show source-provided references
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