Study on thick film resistor and electrode fabricated by laser micro-cladding electronic pastes

Nowadays, electronic devices are required to be smaller, to have a high-density integration and to be of lower cost. In order to meet the developing demands, some new techniques have appeared in recent years. In this paper, a technique named laser micro-cladding electronic pastes is used to fabricate the thick film resistor and electrode units on insulator substrates without using a mask. The results demonstrate that the high-quality resistors could be fabricated by laser micro-cladding. However, the processing steps are very important since they have significant effects on the surface finish, the extent of diffusion between electrode film and resistor film, and on the reliability of the resistors. Laser micro-cladding electronic pastes may become a novel technique to fabricate high quality conductive lines (electrodes) and resistors with good properties that will come into industrial application in the future.