journal article·2007-08-01

Single-Pass and Multi-Pass Laser Cutting of Si–SiC: Assessment of the Cut Quality and Microstructure in the Heat Affected Zone

F. Quintero, J. Pou, F. Lusquiños, A. Riveiro, M. Pérez-Amor, A. J. S. Fernandes

Journal of Laser Applications· Volume 19· Issue 3
Publisher page

Abstract

Experimental investigations on the laser cutting of thick silicon infiltrated silicon carbide (Si–SiC) elements are presented. Si–SiC is a fully dense ceramic composite with high hardness and chemical and thermal stability, which makes it a valuable material in severe conditions. However, machining is still a challenging task. A pulsed Nd:YAG laser was employed to explore the quality of different techniques for the laser cutting of Si–SiC elements with a thickness of 6 mm. In this work, the feasibility of a single-pass technique in comparison with a multi-pass laser cutting was explored for different processing parameters and using both inert and reactive assist gas. A systematic evaluation of the cut quality was assessed by examination of the cross section of samples by optical and electron microscopy, compositional microanalysis, and Raman spectroscopy.
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Research context

OpenAlex topics: Advanced Surface Polishing Techniques · Laser Material Processing Techniques · Diamond and Carbon-based Materials Research

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Departamento Física Aplicada, E.T.S. Ingenieros Industriales, University de Vigo, 36310 Vigo, Spain

Department of Physics, University of Aveiro, 3810-193 Aveiro, Portugal

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