journal article·2012-02-01

Fabrication of microtransmittance grating using laser induced backside dry etching

He Chao, Liu Furong, Zhou Weiping, Chen Jimin

Journal of Laser Applications· Volume 24· Issue 1
Publisher page

Abstract

Laser induced backside dry etching (LIBDE) is a novel technique, which applied in the micromachining and nanomachining of transparent dielectric materials used for optical elements by direct laser irradiation with the assistance of solid mediums as an absorbed layer. On the basis of exploring two different solid mediums, i.e. Al2O3 powder and alumina ceramic wafer as absorbers, LIBDE with 1064 nm central wavelength pulsed ytterbium doped fiber laser as the irradiation source was successfully applied for the fabrication of periodical microscaled structures on fused silica. The threshold of laser fluence to etch fused silica was 7.47 J/cm2 extrapolated from the experimental data. By using alumina ceramic wafer as the absorber, a microbinary dimensional transmittance grating with the constant of 25 μm was obtained on the silica. The depth of the trench is 4.2 μm, and the root mean square roughness of the trench bottom is below 40 nm according to the measurement of 3D profiler. Additionally, diffraction patterns were observed by the normal incidence of a 532 nm diode indicator laser to examine the optical features of the microbinary grating etched under the different laser fluences.
Source: crossref · Quality: baseline

Research context

OpenAlex topics: Laser Material Processing Techniques · Advanced Surface Polishing Techniques · Optical Coatings and Gratings

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Institute of Laser Engineering, Beijing University of Technology , Chaoyang District, Beijing 100124, China

References (18)

Show source-provided references
1. 2001
2. Application of diffractive optical elements in maskless lithography
3. Excimer laser ablation of glass-based arrayed microstructures for biomedical, mechanical, and optical applications10.2351/1.1848520 ↗
4. Diffractive optical elements arrays with continuous deep-relief for maskless lithography
5. Development of a new optical heterodyne microscope for fluid velocity measurements in a micro-channel
6. Time-resolved measurements during backside dry etching of fused silica10.1016/j.apsusc.2009.04.077 ↗
7. Laser etching of fused silica using an adsorbed toluene layer10.1007/s00339-004-2961-y ↗
8. Backside etching of fused silica with ultra-short laser pulses at the interface to absorbing liquid10.1088/1742-6596/59/1/037 ↗
9. Crack-free micromachining on glass substrates by visible LIBWE using liquid metallic absorbers10.1016/j.apsusc.2010.06.041 ↗
10. Influence on the laser induced backside dry etching of thickness and material of the absorber, laser spot size and multiples irradiation10.1016/j.apsusc.2007.08.068 ↗
11. Laser-induced backside dry and wet etching of transparent materials using solid and molten tin as absorbers10.1007/s00339-009-5078-5 ↗
12. Etching and forward transfer of fused silica in solid-phase by femtosecond laser-induced solid etching (LISE)10.1016/j.apsusc.2009.05.060 ↗
13. Nano-patterning by diffraction mask-projection laser ablation10.2961/jlmn.2008.01.0003 ↗
14. Effect of liquid environment on laser-induced backside wet etching of fused silica10.1063/1.3294615 ↗
15. Mechanism of backside etching of transparent materials with nanosecond UV-lasers10.1007/s00339-010-5878-7 ↗
16. Ultrashort-pulse laser ablation of indium phosphide in air10.1007/s003390000596 ↗
17. Laser induced backside dry etching of transparent materials10.1016/j.apsusc.2007.02.068 ↗
18. Microstructuring of fused silica by laser-induced backside wet etching using picosecond laser pulses10.1016/j.apsusc.2010.05.055 ↗