Protecting the edge: Ultrafast laser modified C-shaped glass edges
Source abstract
Abstract
A procedure and optical concept is introduced for ultrashort pulsed laser cleaving of transparent materials with tailored edges in a single pass. The procedure is based on holographically splitting a number of foci along the desired edge geometry including C-shaped edges with local 45° tangential angles to the surface. Single-pass, full-thickness laser modifications are achieved requiring single-side access to the workpiece only without inclining the optical head. After having induced laser modifications with feed rates of ∼1m/s, actual separation is performed using a selective etching strategy.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Laser Material Processing Techniques · Advanced Surface Polishing Techniques
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
TRUMPF Laser- und Systemtechnik GmbH , Johann-Maus-Str. 2, 71254 Ditzingen, Germany
References (35)
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