Characteristic features of an apparatus for plasma immersion ion implantation and physical vapour deposition
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OpenAlex topics: Metal and Thin Film Mechanics · Copper Interconnects and Reliability · Plasma Diagnostics and Applications
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References (10)
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10. Hartmann · J. Vac. Sci. Technol. A · 1996 · 14 · 314410.1116/1.580183 ↗