Laser glass cutting techniques—A review
Source abstract
Abstract
With the advancement of glass technology in recent times, glass has become one of the most important engineering materials in architectural, medical, automotive, flat panel display, and electronics applications. Desired shape and size of the glass can only be achieved through accurate and precise cutting technique. Laser technology has an advantage over traditional cutting processes for glass due to good quality, surface finish, and high speed of operation. This paper provides a review of all the laser glass cutting techniques discovered in recent work and forms a comparison framework, in particular, their limitations and their current status which would facilitate prospective research and future development.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Laser Material Processing Techniques · Ocular and Laser Science Research · Glass properties and applications
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Department of Industrial Manufacturing Engineering and Management, PN Engineering College, National University of Sciences and Technology , PNS Jauhar, Karachi 75350, Pakistan
Manufacturing and Laser Processing Research Group, School of Mechanical, Aerospace and Civil Engineering, The University of Manchester , Manchester M60 1QD, United Kingdom
References (71)
Show source-provided references
1. Characteristics of cutting parameters and their effect on the glass edge quality10.1023/A:1013926908241 ↗
2. Study of cutting quality for TFT-LCD glass substrate10.1007/s00170-007-1293-4 ↗
3. Tool wear and surface finish in diamond cutting of optical glass10.1016/j.jmatprotec.2005.02.248 ↗
4. Nonconventional cutting of plate glass using hot air jet: Experimental studies10.1016/S0957-4158(00)00033-7 ↗
5. Experimental development of a machining database for the CO2 laser cutting of ceramic tile10.2351/1.4745465 ↗
6. Laser cutting of glass10.1117/12.405287 ↗
7. A study of cutting glass by laser10.1117/12.456849 ↗
8. Laser cutting of float glass during production10.1007/s10717-006-0112-y ↗
9. A study of thermal cutting of glass10.1111/j.1151-2916.1999.tb02058.x ↗
10. Simulation of glass cutting with an impinging hot air jet10.1016/j.ijsolstr.2003.09.059 ↗
11. Waterjet cutting of cross-linked glass10.1116/1.579427 ↗
12. Waterjet: A promising method for cutting optical glass10.1364/AO.45.003477 ↗
13. Performance of different abrasive materials during abrasive waterjet machining of glass10.1016/j.jmatprotec.2007.03.071 ↗
14. Device for machining material with a laser
15. Waterjet-guided laser processing10.1117/12.486514 ↗
16. The best of both worlds—Laser and waterjet combined in a new process: The waterjet guided laser
17. Chip singulation process with a waterjet guided laser
18. Small power pulsed and continuous longitudinal CO2 Laser for material processing10.1117/12.378741 ↗
19. D. J. Garibotti, “Dicing of micro-semiconductors,” U.S. patent 3,112,850 (3 December 1963).
20. Controlled separation of brittle materials using a laser
21. Thermal stress cleaving of brittle materials by laser beam10.1016/S0007-8506(07)61487-5 ↗
22. Laser cutting with controlled fracture and pre-bending applied to LCD glass separation10.1007/s00170-006-0422-9 ↗
23. Application of Iterative path revision technique for laser cutting with controlled fracture10.1016/S0143-8166(02)00147-1 ↗
24. Applying an on-line crack detection technique for laser cutting by controlled fracture10.1007/s001700170015 ↗
25. Fracture mechanism of laser cutting with controlled fracture10.1115/1.1559163 ↗
26. D. K. Patel and J. D. Baker, “Method for laser scribing substrates,” U.S. patent 5,116,641 (26 May 1992).
27. K. S. Wills, P. A. Rodriguez, and M. Brewer, “Wafer scribe technique using laser by forming polysilicon,” U.S. patent 5,543,365 (6 August 1996).
28. Laser processing and cutting of transparent materials10.1070/QE1987v017n04ABEH008695 ↗
29. Subsurface precision machining of glass substrates by innovative lasers
30. Display glass cutting by femtosecond laser induced single shot periodic void array10.1007/s00339-008-4672-2 ↗
31. Study on laser breaking of glass plate. I. Generation and Growth of vertical cracks by scribing10.2493/jjspe.62.413 ↗
32. Study on laser breaking of glass plates (2nd report). The optimum CO2 Laser beam irradiating condition10.2493/jjspe.66.213 ↗
33. Laser separation of flat glass in electronic-, optic-, display- and bio-industry10.1117/12.592659 ↗
34. Advanced glass separation (laser cutting)
35. Laser enhanced processing methods for FPD manufacturing
36. Cutting glass substrates with dual-laser beams10.1016/j.optlaseng.2008.12.009 ↗
37. 2005
38. F. J. Grove, D. C. Wright, and F. M. Hamer, “Cutting of glass with a laser beam,” U.S. patent 3,543,979 (1 December 1970).
39. Laser cutting of hot glass
40. Laser cutting of decorative glass ceramic tile
41. Temperature and residual stress evolution in CO2 Laser irradiated glass10.1117/12.321542 ↗
42. Thermal severing. The cutting of brittle materials by thermally induced fracture
43. Laser cutting of silica glasses by using the controlled fracture technique
44. Diamond scribing and laser breaking for LCD glass substrates10.1016/j.jmatprotec.2007.07.017 ↗
45. Pulsed laser breaking technique for glass substrates10.1117/12.809728 ↗
46. Investigation of an active stressing technique for delaying fracture during laser cutting of alumina
47. Separating and structuring of brittle material by the use of laser radiation10.1117/12.541166 ↗
48. Characterisation of the laser cleaving on glass sheets with a line-shaped laser beam10.1016/j.optlastec.2006.07.005 ↗
49. Final glass products in one processing step by the means of laser radiation
50. V. S. Kondratenko, “Method of splitting non-metallic materials,” U.S. patent 5,609,284 (11 March 1997).
51. H. Ostendarp, C. Hermans, D. Hauer, and J. Stein, “Method and apparatus for cutting through a flat workpiece made of brittle material, especially glass,” U.S. patent 5,984,159 (16 November 1999).
52. Laser cutting of thin glass in production technology
53. The cutting edge of laser technology
54. On the numerical modeling of laser shearing of glass sheets used to optimize production methods10.1243/095440604322786901 ↗
55. Thermal stress analysis on laser scribing of glass
56. Thermal stress analysis on laser scribing of glass10.2351/1.2995761 ↗
57. Effect of thermal stresses on chip-free diode laser cutting of glass10.1016/j.optlastec.2008.05.025 ↗
58. The effect of laser beam geometry on cut path deviation in diode laser chip-free cutting of glass10.1115/1.4000695 ↗
59. The effect of continuous and pulsed beam modes on cut path deviation in diode laser cutting of glass10.1007/s00170-009-2373-4 ↗
60. The effect of material thickness, laser power and cutting speed on cut path deviation in high-power diode laser chip-free cutting of glass10.1016/j.optlastec.2010.01.024 ↗
61. Numerical analysis of cutting glass by dual CO2 laser beams10.1117/12.753774 ↗
62. A Numerical simulation of machining glass by dual CO2-laser beams10.1016/j.optlastec.2007.05.003 ↗
63. Laser cleaving on glass sheets with multiple laser beams10.1016/j.optlaseng.2007.12.006 ↗
64. Laser glass machining for crack initiation and edge seaming in flat panel display manufacturing
65. The deep penetration of hf laser light into glass and its possible industrial use
66. Laser processing of glass by picosecond pulses10.1070/QE1994v024n08ABEH000178 ↗
67. Cutting of glass by picosecond laser radiation10.1016/0030-4018(94)90326-3 ↗
68. Cutting of optical materials by using femtosecond laser pulses10.1117/12.448036 ↗
69. Glass cutting by femtosecond pulsed irradiation10.1117/1.1668274 ↗
70. New methods of cleaving glass by ultraviolet laser radiation
71. Laser processing of optical material: Drilling, dicing and modifying thin glass