Monitoring Adhesive Joints Using Piezoelectric Polymer Film
Source abstract
Abstract
Adhesive joint monitoring techniques employing poly(vmylidene fluoride) piezoelectric film are discussed. Adhe sive cure monitoring and void/porosity detection were performed ultrasonically using the film. Cyclic bond-normal stresses were quantified by imbedding film sensors into the adhesive bondline and measuring the electrical voltages produced in the sensors by the stresses.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Silicone and Siloxane Chemistry · Advanced Sensor and Energy Harvesting Materials · Analytical Chemistry and Sensors
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Thiokol Corporation P.O. Box 707 Brigham City, UT 84302-0707
References (10)
Show source-provided references
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