The Feasibility of Embedded Electronics for Intelligent Structures

The signal, power, and communications provisions for the distributed con trol processing, sensing, and actuation of an intelligent structure could benefit from a method of physically embedding some electronic components. The preliminary feasibility of embedding electronic components in load-bearing intelligent composite structures is addressed. A technique for embedding integrated circuits on silicon chips within graphite/ epoxy composite structures is presented which addresses the problems of electrical, mechanical, and chemical isolation. The mechanical isolation of test articles manufac tured by this technique is tested by subjecting them to static and cyclic mechanical loads; chemical isolation is tested by subjecting them to electrical bias in a high temperature, high humidity environment. The likely failure modes under these conditions are iden tified, and suggestions for further improvements in the technique are discussed.