Three-dimensional printed embedded channel–based resistive strain sensor: Fabrication and experimental characterization
Source abstract
Abstract
This work explores the feasibility of commercially available elastic filament and desktop fused deposition modeling three-dimensional printing as a simple and cost-effective route to develop flexible sensors. The fabricated sensor consists of a three-dimensional printed flexible substrate with embedded U-shaped channels that are filled with Galinstan (Ga 68.5% In 21.5% Sn 10%) liquid metal conductor. When the sensor is strained, the cross-sectional area of the channels decreases causing a reduction in the conducting area and, therefore, a change in resistance. First, sensors measuring approximately 2100 μm by 200 μm are fabricated. Results demonstrate gauge factors of approximately 2.1 at 38.8% strain with high linearity and little hysteresis. In addition, smaller strain sensors, measuring approximately 696 µm by 203 µm, are fabricated with gauge factors of nearly 1.0 at 13.2% strain. Results show that substrate relaxation plays an essential role in determining the functionality of these sensors. The Mullins effect largely influences the recovery properties of the rubber-like sensor substrate. This leads to a noticeable relaxation in the substrate during cyclic loading. The results demonstrate the potential of commercially available fused deposition modeling three-dimensional printing technology and filaments to produce complex designs and sensor platforms.
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Research context
OpenAlex topics: Advanced Sensor and Energy Harvesting Materials · Additive Manufacturing and 3D Printing Technologies · Adhesion, Friction, and Surface Interactions
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Institute for Micromanufacturing, College of Engineering and Science, Louisiana Tech University, Ruston, LA, USA
Department of Mechanical Engineering, College of Engineering and Science, Louisiana Tech University, Ruston, LA, USA
Department of Nanosystems Engineering, College of Engineering and Science, Louisiana Tech University, Ruston, LA, USA
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