Capacitance changes in thin piezoelectric transducers embedded in isotropic host materials
Source abstract
Abstract
Constraining a piezoelectric material from freely expanding causes a reduction in capacitance. This reduction in capacitance has implications in energy harvesting, active vibration control, and ultrasonic sensing. This article investigates the reduction in capacitance when a thin piezoelectric disk is embedded in an isotropic host material. Both simplified (one-dimensional axisymmetric) and computational (finite element two-dimensional axisymmetric) analyses have been presented and used to calculate the expected reduction in capacitance of thin embedded piezoelectric disks for a number of ceramic-based piezoelectric materials. The analyses show that there is a non-linear relationship between the capacitance and the elastic modulus of the host material; with increasing host modulus, capacitance initially decreases rapidly but then asymptotically converges to the fully constrained case. A simplified equivalent spring axisymmetric model has been derived from the finite element model and has been used to explain some of the key geometric and material properties that effect the reduction in embedded capacitance. Preliminary experimental results show some agreement with the derived models; however, substantial further validation is required. Some implications of the derived results for energy harvesting are also discussed.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Acoustic Wave Phenomena Research · Ultrasonics and Acoustic Wave Propagation · Structural Health Monitoring Techniques
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Department of Mechanical Engineering, The City College of New York, New York, NY, USA
School of Civil and Environmental Engineering, The University of the Witwatersrand, Johannesburg, South Africa
The Boeing Company, Huntsville, AL, USA
References (31)
Show source-provided references
1. 10.1007/s10443-011-9198-710.1007/s10443-011-9198-7 ↗
2. 10.1063/1.171202010.1063/1.1712020 ↗
3. 10.23919/ACC.1988.479003510.23919/ACC.1988.4790035 ↗
4. 10.1088/0964-1726/21/4/04700110.1088/0964-1726/21/4/047001 ↗
5. 10.1002/978111999115110.1002/9781119991151 ↗
6. 10.1061/(ASCE)0733-9410(1991)117:9(1363)10.1061/(ASCE)0733-9410(1991)117:9(1363) ↗
7. 10.1177/1045389X0505010310.1177/1045389X05050103 ↗
8. 10.1106/A1HU-23JD-M5AU-ENGW10.1106/A1HU-23JD-M5AU-ENGW ↗
9. 10.2514/6.1995-121210.2514/6.1995-1212 ↗
10. 10.1088/0964-1726/15/6/03810.1088/0964-1726/15/6/038 ↗
11. Hu B · ACI Materials Journal · 2013 · 110 · 149
12. 10.1088/0964-1726/18/7/07500110.1088/0964-1726/18/7/075001 ↗
13. 10.1177/1045389X940050010210.1177/1045389X9400500102 ↗
14. 10.1016/S0266-3538(02)00007-610.1016/S0266-3538(02)00007-6 ↗
15. 10.1088/0964-1726/13/5/01910.1088/0964-1726/13/5/019 ↗
16. 10.1088/0964-1726/7/6/01010.1088/0964-1726/7/6/010 ↗
17. 10.1007/s11340-006-9013-910.1007/s11340-006-9013-9 ↗
18. 10.1016/j.actamat.2004.07.03710.1016/j.actamat.2004.07.037 ↗
19. 10.1117/12.35071010.1117/12.350710 ↗
20. Piezo Systems Inc. (2017) Available at: www.piezo.com/prodmaterialprop.html
21. 10.1088/0964-1726/17/5/05500510.1088/0964-1726/17/5/055005 ↗
22. Sala G, Olivier M (2004) Embedded piezoelectric sensors and actuators for control of active composite structures. Available at: http://naca.central.cranfield.ac.uk/dcsss/2004/D13_47_SalaEDITfinal.pdf
23. 10.1177/1045389X1351218810.1177/1045389X13512188 ↗
24. 10.1177/1045389X1664229910.1177/1045389X16642299 ↗
25. 10.1098/rspa.1946.007710.1098/rspa.1946.0077 ↗
26. 10.1088/0964-1726/16/4/00310.1088/0964-1726/16/4/003 ↗
27. 10.1088/0964-1726/15/6/05010.1088/0964-1726/15/6/050 ↗
28. 10.1016/j.jsv.2006.01.02010.1016/j.jsv.2006.01.020 ↗
29. 10.1177/1045389X0606588510.1177/1045389X06065885 ↗
30. 10.1177/1045389X1140630310.1177/1045389X11406303 ↗
31. 10.1063/1.299208110.1063/1.2992081 ↗