Optimized Parallel Interrogation and Protection of Piezo-transducers in Electromechanical Impedance Technique
Source abstract
Abstract
This article presents some of the practical issues concerning the implementation of the electromechanical impedance (EMI) technique for structural health monitoring (SHM) using piezoelectric ceramic (PZT) transducers. New sensor interrogation algorithms utilizing the sensor multiplexing technique are proposed to reduce the time required in interrogating the PZT patches one-by-one for localizing damage. Environmental effects on the admittance signatures of the PZT patch are considered, and a simple and economical technique is proposed to protect the PZT patches. Finally, practical application of PZT transducers in the monitoring of concrete curing is demonstrated.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Ultrasonics and Acoustic Wave Propagation · Structural Health Monitoring Techniques · Non-Destructive Testing Techniques
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Division of Structures and Mechanics, School of Civil and Environmental Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798
Department of Civil Engineering, Indian Institute of Technology, Delhi, Hauz Khas, New Delhi 110 041, India
Division of Structures and Mechanics, School of Civil and Environmental Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798,
References (24)
Show source-provided references
1. Agilent Technologies Inc., 2004. Test and Measurement Catalogue, USA.
2. Bhalla, S. 2001. “Smart System Based Automated Health Monitoring of Structures,” M.Eng. Thesis, Nanyang Technological University, Singapore.
3. 10.1061/(ASCE)0893-1321(2004)17:4(154)10.1061/(ASCE)0893-1321(2004)17:4(154) ↗
4. 10.1061/(ASCE)0893-1321(2004)17:4(166)10.1061/(ASCE)0893-1321(2004)17:4(166) ↗
5. Dow Corning Corporation, 2004. http://www.dowcorning.com.
6. Giurgiutiu, V. · 433
7. 10.1106/N0J5-6UJ2-WlGV-Q8MC10.1106/N0J5-6UJ2-WlGV-Q8MC ↗
8. Hewlett-Packard · 1996
9. 10.1177/1045389X940050010210.1177/1045389X9400500102 ↗
10. Malhotra, V.M. · 1976
11. Mide Technology Corporation, 2004. http://www.mide.com/.
12. 10.1299/jsmea.42.24910.1299/jsmea.42.249 ↗
13. 10.1061/(ASCE)1076-0342(2000)6:4(153)10.1061/(ASCE)1076-0342(2000)6:4(153) ↗
14. 10.1002/eqe.7210.1002/eqe.72 ↗
15. 10.1177/0583102403035600110.1177/05831024030356001 ↗
16. PI Ceramic GmbH, 2004, Product Information Catalogue, Lindenstrabe, Germany, http://www.piceramic.de.
17. Reactec Ltd., 2005, http://www.reactec.co.uk/.
18. RS Components Ltd, 2004, Northants, United Kingdom, http://www.rs-components.com.
19. 10.1016/S1359-8368(01)00017-810.1016/S1359-8368(01)00017-8 ↗
20. 10.1061/(ASCE)0733-9445(1994)120:1(290)10.1061/(ASCE)0733-9445(1994)120:1(290) ↗
21. 10.1088/0964-1726/14/4/02610.1088/0964-1726/14/4/026 ↗
22. 10.1088/0964-1726/9/4/31710.1088/0964-1726/9/4/317 ↗
23. Sun, F.P. · 236
24. 10.1088/0964-1726/11/3/30110.1088/0964-1726/11/3/301 ↗