Technology of Preparing Diamond Wire Cut Multicrystalline Silicon Wafer Texture Surfac
Source abstract
Abstract
The texturization technology of multicrystalline silicon wafers is the key step of solar cell manufacture.
Only a short abstract or summary was supplied by the source.
Source: openalex_inverted_index · Quality: short
Research context
OpenAlex topics: Chemistry and Stereochemistry Studies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (12)
Show source-provided references
1. SWANSON R M.Photovoltaics power u. Science, 2009, 324(5929): 891-892.10.1126/science.1169616 ↗
2. MÖLLER H J, FUNKE C, RINIO M,et al. Multicrystalline silicon for solar cell. Thin Solid Films, 2005, 487(1): 179-187.10.1016/j.tsf.2005.01.061 ↗
3. MEINEL B, KOSCHWITZ T, BLOCKS C, et al. Comparison of diamond wire cut and silicon carbide slurry processed silicon wafer surfaces after acidic texturisation. Materials Science in Semiconductor Processing, 2014, 26: 93-100.10.1016/j.mssp.2014.03.046 ↗
4. WATANABE N, KONDO Y, IDE D,et al. Characterization of polycrystalline silicon wafers for solar cells sliced with novel fixed-abrasive wir. Progress in Photovoltaics: Research and Applications, 2010, 18(7): 485-490.10.1002/pip.923 ↗
5. YU X, WANG P, LI X,et al. Thin Czochralski silicon solar cells based on diamond wire sawing technolog. Solar Energy Materials and Solar Cells, 2012, 98: 337-342.10.1016/j.solmat.2011.11.028 ↗
6. CHEN C C A, CHAO P H. Surface texture analysis of fixed and free abrasive machining of silicon substrates for solar cell.Advanced Materials Research, 2010, 126: 177-180.10.4028/www.scientific.net/AMR.126-128.177 ↗
7. MEINEL B, KOSCHWITZ T, ACKER J.Textural development of SiC and diamond wire sawed sc-silicon wafe.Energy Procedia, 2012, 27: 330-336.10.1016/j.egypro.2012.07.072 ↗
8. QIU MING-BO, HUANG YIN-HUI, LIU ZHI-DONG,et al. A review of the fabrication methods for solar silicon wafe. Mechanical Science and Technology for Aerospace Engineering, 2008, 27(8): 1017-1020.
9. LIU XIAO-MEI, CHEN WEN-HAO, LI MIAO, et al. Vapor etching method for diamond wire sawn multicrystalline silicon wafers. Acta Photonica Sinica, 2014(11): 26-29.10.3788/gzxb20144311.1116006 ↗
10. 林育琼. 酸腐蚀液调节多晶硅表面结构的研. 上海: 上海交通大学硕士学位论文, 2011.
11. 刘志刚. 多晶硅太阳电池新腐蚀液的研究及其应. 上海: 上海交通大学博士学位论文, 2006.
12. 刘小梅. 金刚石线锯切割多晶硅片的表面性质与刻蚀制绒方法研. 南昌: 南昌大学博士学位论文, 2014.