Effect of Plating Solution Flow Pattern on Preparation of Electroless Copper- Plated Carbon Foam under Vacuum and Ultrasonic Condition

Electroless plating with assistance of vacuum and ultrasonic is an effective method to coat copper onto the inner surface of bulk carbon foam.However, it is difficult to obtain uniform copper coating.In present work, the copper coating's uniformity was improved by forcing plating solution inside the carbon foam on basis of vacuum and ultrasonic assistance during eletroless plating process.And effect of the flow pattern on plated copper's properties was investigated.Compared with one-direction flow of plating solution, a bidirectional flow made the weight gain rate of single cut piece >7.10% and the total weight increased up to 7.68%.The copper coating at thickness >5 m; with better uniformity was compact, smooth and no CuO or Cu 2 O.The mechanical and electrical properties of Cu/carbon foam were evenly enhanced.The compression strength was increased from 0.70 MPa to 1.54 MPa, and the conductivity from 700 S/cm to 1724 S/cm.