Direct Bonding Copper to Aluminium Nitride Substrate

The effects of surface oxidation on the bonding strength were investigated. The results suggested that bonding could not be achieved without surface oxidation because of the no wetting of Cu[O] eutectic liquid. While, the wetting of the eutectic liquid could be promoted by surface oxidation, and the bonding strength was greatly affected by the surface oxidation form. Compared with specimen oxidized in wet atmosphere (N2:O2=10:l), the specimen oxidized in dry air achieved stronger' bonding strength. The bonding strength of 2.8kg-mm-2 was obtained for the specimen oxidized at 1300℃ for 30 min, with the 2-3μm interlayer in thickness, and CuAlO2 as interface production.