Research on Slipcasting Process for BaTiO_3-based Chip PTCR
Source abstract
Abstract
In order to acquire highly concentrated BaTiO_3 slurry suitable for slipcasting process, the factors, that may influence the property of slurry, were investigated. The results obtained show that when pH=9 and the weight concentration of PVA and dispersant is 0.8% and 0.4% respectively, the solids loading as high as 80wt%(55vol%) can be achieved. In addition, The PTCR effect of chip PTCR formed by this slipcasting process was examined.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Advanced Surface Polishing Techniques
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