Study on Feasibility of Joining Si_3N_4 Ceramics by Oxynitride Glass
Source abstract
Abstract
Y-Si-Al-O-N glass was used to bond and wet dense Si_3N_4 ceramic at 1450℃ and 16000℃ for30 min, respectively. The result showed that the oxynitride glass can wet well to Si_3N_4 ceramic.At 14500℃, there was obvious difference in the coefficients of thermal expansion of the glass andSi_3N_4, while at 16000℃, the difference decreased. A diffusion layer existed near the joint. Theoxynitride glass can be used to join Si_3N_4 ceramics.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Advanced ceramic materials synthesis · 3D IC and TSV technologies · Microwave Dielectric Ceramics Synthesis
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